Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications

04/09/2024 | Indium Corporation
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT

09/23/2022 | Indium Corporation
Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications, during two presentations at the International Electronics Manufacturing Technology (IEMT) conference, Oct. 19-21, Putrajaya, Malaysia.

Indium’s Jason Chou to Present at SEMICON Taiwan

08/16/2022 | Indium Corporation
Indium Corporation senior area technical manager, Jason Chou, will present on low-temperature solders at SEMICON Taiwan’s TechXPOT on Thursday, September 15, in Taipei, Taiwan.

Indium to Showcase Durafuse Technology at EPP InnovationsFORUM

06/01/2022 | Indium Corporation
Indium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.

Indium Corporation to Feature Innovative New Alloy at IPC APEX Expo 2020

12/03/2019 | Indium Corporation
Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in