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GEN3 Announces First Shipment of Next-GENeration CM Contaminometer to Renowned Aerospace Company in Germany

07/09/2024 | Gen3
GEN3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce the first shipment of its newly released next-GENeration CM Contaminometer Process Ionic Contamination Tester to a world renowned aerospace company at their facility in Germany.

Siemens Advances Integrated Circuit Test and Analysis at 5nm and Below

07/09/2024 | Siemens
Siemens Digital Industries Software introduced Tessent™ Hi-Res Chain software, a new tool designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes, where even minor process variations can significantly impact yield and time-to-market.

Collaboration Station

07/03/2024 | I-Connect007 Editorial Team
As a PCB designer working for an EMS provider, Kelly Dack has seen his share of boards fail because they were designed in a vacuum; the designer simply threw the design “over the wall” and hoped for the best. In this interview, Kelly discusses the need for collaboration between all the stakeholders involved in designing and manufacturing the PCB. As Kelly points out, IPC’s CID curriculum provides a great framework for setting up a collaboration culture in your company, and standards help enable this kind of environment.

Increase Test and Fault Coverage Through Interactive Tests

07/01/2024 | Acculogic Inc.
New extended capabilities have been added to the proven integration package combining the FLS 980Dxi flying probe tester from Acculogic with the Embedded JTAG Solutions from GOEPEL electronic.

ispace RESILIENCE Lunar Lander Successfully Achieves Testing Milestone in Preparation for Mission 2

06/28/2024 | BUSINESS WIRE
ispace, inc., a global lunar exploration company, announced today that the flight model of its HAKUTO-R Mission 2 RESILIENCE lunar lander has successfully completed thermal vacuum testing and remains on schedule for a Winter 2024 launch.
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