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EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities

02/18/2025 | Pete Starkey, I-Connect007
“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”

SMTA Provides Financial and Mentorship Support for Students of Manufacturing

02/17/2025 | Marcy LaRont, I-Connect007
The shortage of skilled workers in the electronics manufacturing is one of today’s most pressing issues. (Check out the January 2025 issue of PCB007 Magazine for more on this topic.) So, it was not surprising that the topic of workforce was present at DesignCon this year as well. During the show, I spoke with Saniya Pilgaonkar, manager of SMTA membership services, who provided information on not one, but two SMTA scholarships/grants.

Zhen Ding Selected for the 2025 S&P Global Sustainability Yearbook

02/17/2025 | Zhen Ding
Zhen Ding Technology Holding Limited was honored with international recognition for sustainability as it was selected for the S&P Global Sustainability Yearbook for the third consecutive year.

Jaltek Sponsors Employee Through Senior Leader Apprenticeship Programme

02/17/2025 | Jaltek
Jaltek is thrilled to be sponsoring Business Development Manager, Jack Groom through his Level 7 Senior Leader Apprenticeship programme, at the University of Bedfordshire. Jack started the course in September 2023 and last month he received his Postgraduate Diploma in Business Administration and in March he will complete and receive the Senior Leader Apprenticeship.

Managing Energy Flow with Proper Stackup Design 

02/13/2025 | Andy Shaughnessy, Design007
At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 
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