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Women in Electronics Keynote Review: A Life and Career Filled With Humor

04/03/2026 | Michelle Te, I-Connect007
In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”

Educational Highlights From the APEX EXPO 2026 Show Floor

03/27/2026 | Kimberly Kutnick, Global Electronics Association
APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.

Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute

03/15/2026 | Marcy LaRont, I-Connect007
The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.

American Standard Circuits to Exhibit at the Seattle BCI Defense and Aerospace Summit 2026

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Anaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone, has announced that his company will be attending the Seattle BCI Defense and Aerospace Summit to be held March 18-19, 2026, at the Washington State Convention Center in Seattle, Washington.

Technology Pavilion Debuts at APEX EXPO 2026

02/26/2026 | Global Electronics Association
Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.
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