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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Keiron Printing Technologies Appoints BarTron as Midwest & Ohio Valley Sales Rep
January 29, 2026 | Keiron Printing TechnologiesEstimated reading time: 1 minute
Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, announced that it has appointed BarTron, Inc. as its authorized sales representative for Michigan, Ohio, Western Pennsylvania, Indiana, and Kentucky. BarTron will support the introduction and regional adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest innovation, the Keiron HF2 LiFT Printer.
Founded in July 1989, BarTron, Inc. has built a strong reputation for helping manufacturers solve complex process and production challenges. Through close collaboration with customers and technology partners, BarTron plays a key role in evaluating, implementing, and supporting advanced manufacturing solutions across the electronics assembly industry.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of variability in the SMT process while directly addressing one of the leading causes of assembly defects: inconsistent solder paste application.
The HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ files. This allows manufacturers to adopt digital solder paste printing without changing materials or reworking existing workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes rather than hours—making the system well suited for high-mix and NPI-driven production environments.
A key differentiator of the HF2 printer is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit during the printing process. This built-in verification improves first-pass yield while reducing rework and scrap, without the need for a separate SPI system. The contactless architecture also eliminates common reliability issues associated with clogging, wear, and alignment drift found in traditional printing technologies.
“BarTron’s technical depth and customer-focused approach make them an ideal partner as we expand access to LiFT technology,” said Brian Duffey, President of Keiron Technologies USA. “Their ability to guide manufacturers through evaluation and adoption will be instrumental in bringing the HF2 printer into production environments across the region.”
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Indium Corporation to Feature Precision Gold Solder Solutions at MD&M West 2026
01/26/2026 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, February 3-5, in Anaheim, California.
Altus Supports Cambertronics’ SMT Process Upgrade with Koh Young SPI
01/22/2026 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has supported Cambertronics, an ambitious contract electronics manufacturer celebrating 35 years in 2026, in upgrading its SMT production with the installation of a Koh Young Solder Paste Inspection (SPI) system.
China Leads Hand Soldering World Championship
01/21/2026 | Philippe Leonard, Global Electronics AssociationRegional champions from around the world gathered excitedly at productronica in Munich this past November with one goal: to be crowned the world hand-soldering champion by the Global Electronics Association. Hand soldering is a significant process in printed circuit board assembly. Adhering to procedures, standards, and best practices enables the production of high-quality and reliable solder joints.
Surf-Tech Manufacturing Begins the New Year with Investment in On-Site Nitrogen Generation
01/20/2026 | Surf-Tech ManufacturingSurf-Tech Manufacturing Corp., a multi-faceted provider of contract manufacturing services, has added a NITROSWING® nitrogen generation system from NOVAIR to its production floor, giving customers more consistent soldering performance, improved process control, and reduced exposure to supply disruptions tied to bulk nitrogen deliveries.
Indium Corporation to Highlight FAST Soldering Technology at NEPCON Japan 2026
01/19/2026 | Indium CorporationIndium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo.