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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Magnalytix’s Dr. Mike Bixenman to Present at APEX 2026 Technical Conference
February 25, 2026 | MAGNALYTIXEstimated reading time: 1 minute
Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will co-present the professional development course “The Reliability of the Electronic Assembly and Components as a Function of Assembly Cleanliness” on Sunday, March 15 in Room 304-C of the Anaheim Convention Center as part of the 2026 APEX EXPO Technical Conference.
Bixenman will co-present the session with Adam Klett of KYZEN Corporation and Vladimir Sitko of PBT-Works. The course will provide attendees with an understanding of key complexity factors, including the risks of flux present on highly dense assemblies, signal integrity as conductor width and spacings reduce, key considerations when selecting an aqueous cleaning agent, the impact of component standoffs, how to balance performance, cost, and reliability when selecting the cleaning machine, and qualify the process for acceptable levels of flux and process residues per IPC J-STD-001, Section 8.
Precision, reliability, performance, and stringent levels of cleanliness represent major demands in the design and manufacture of Class 3 electronic assemblies, including those for AI Systems, defense technologies, in addition to automotive and medical devices. The density and number of interconnects in these assemblies result in higher levels of flux and process residues under the component termination.
Bixenman, Klett and Sitko will also highlight how climate, temperature, and airborne contaminants necessitate an insulating condition in assemblies, requiring process residues during assembly to be effectively cleaned. Each of these factors demands higher levels of cleanliness in finished assemblies and will be addressed during the course.
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Sweeney Ng - CEE PCBSuggested Items
DISTRON Expands In-House Capabilities with Automated Conformal Coating for Complex PCBA
04/02/2026 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has expanded its manufacturing capabilities with the addition of in-house automated conformal coating, designed to support complex PCB assemblies and high-reliability applications.
Learning with Leo: Why Risk-based Auditing Is Reshaping Cable Assembly Quality
04/01/2026 | Leo Lambert -- Column: Learning With LeoEffective product development requires early and active participation from all stakeholders. The design process must include input from supply chain, manufacturing engineering, purchasing, quality, and production. A design cannot be considered complete until it has been evaluated against the full manufacturing process, whether executed by an OEM or a subcontractor. Without this collaboration, designs are often released that are not manufacturable in real-world conditions.
Indium Corporation Experts to Present on Array of Solder and Thermal Management Solutions at APEX EXPO 2026
03/12/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX EXPO 2026, March 17-19, in Anaheim, California.
ICTC Joins SMTA to Advance Collaboration, Knowledge Sharing, and Electronics Manufacturing Excellence
01/22/2026 | ICTCInterconnect Cable Technologies Corporation (ICTC), a global contract manufacturer specializing in high-reliability electronic assemblies, cable and wire harnesses, PCB assemblies, and turnkey box builds, is proud to announce its new membership in the Surface Mount Technology Association (SMTA).
Sypris Wins Expanded Follow-On Award for Deep Space Program
01/21/2026 | Sypris Electronics LLCSypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received an expanded follow-on award from a leading U.S. aerospace and defense contractor to produce and test circuit card assemblies for use in Orion spacecraft supporting the missions of NASA’s Artemis program. Production is scheduled to begin in 2026.