-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 4 minutes

Samsung: A Copy & Paste Company?
Headlines of the Week
(Contact haverhill@dknreseach.com for further information on the news.)
1. Hitachi Chemical (Major electronic material supplier in Japan) 6/26
The supplier has commercialized a wave length conversion powder that changes UV rays to visible light for photovoltaic cells.
2. Hitachi (Major electric and electronics company in Japan) 6/26
The company has developed a new double-sided liquid cooling module for power devices such as SiC and GaN. It doubles the power capacity of the package.
3. AIST (R&D organization in Japan) 6/26
The organization has developed a new welding process for packaging MEMS devices. The process can be conducted at room temperature and by using one ATM ultra flat surface.
4. Mitsubishi Material (Major material supplier in Japan) 6/30
The supplier has organized a new division in the U.S. to recycle electronics scraps to collect precious metals.
5. DENSO (Major car module manufacturer in Japan) 7/1
The manufacturer will invest $35.8 million to expand the manufacturing capacity of transmission modules in Mexico to cover the growing market in north America.
6. AIST (R&D organization in Japan) 7/7
The organization has developed a next-generation photovoltaic cell with multiple conjunctions. It combines GaAs and other materials including CIGS and Si.
7. TANAKA (Specialty metal material supplier in Japan) 7/8
The supplier has developed a new screen-printable silver ink paste curable by UV irradiation. It can generate fine lines down to 70 microns.
8. FDK (Major device manufacturer in Japan) 7/8
The manufacturer has commercialized a new SMT-type high power inductor, “MCP Series 2016D,” for mobile products.
9. Toshiba (Major electric and electronics company in Japan) 7/9
The company has unveiled a new sticky sheet type wearable sensor module, “Silmee Bar type." The measured data can be sent directly to a smart phone or tablet PC.
10. Alps Electric (Major device manufacturer in Japan) 7/8
The manufacturer has unveiled the industry's thinnest connector (SCGH1B Series, 0.69 mm high) for micro SD memory cards (PCB cut-off type).
Recent Articles from DKN Research
To view past articles, click here.
Page 2 of 2More Columns from EPTE Newsletter
EPTE Newsletter: Travel to Japan During COVIDEPTE Newsletter: A New COVID Surge in Taiwan?
EPTE Newsletter: COVID-19 PCR Test in Japan
EPTE Newsletter: Japan Failing in Vaccine Distribution
EPTE Newsletter: A Long Trip to the U.S.
EPTE Newsletter: Ten Years After Fukushima
EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers
EPTE Newsletter: The Printed Circuit Industry in China