-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 4 minutes
Samsung: A Copy & Paste Company?
Headlines of the Week
(Contact haverhill@dknreseach.com for further information on the news.)
1. Hitachi Chemical (Major electronic material supplier in Japan) 6/26
The supplier has commercialized a wave length conversion powder that changes UV rays to visible light for photovoltaic cells.
2. Hitachi (Major electric and electronics company in Japan) 6/26
The company has developed a new double-sided liquid cooling module for power devices such as SiC and GaN. It doubles the power capacity of the package.
3. AIST (R&D organization in Japan) 6/26
The organization has developed a new welding process for packaging MEMS devices. The process can be conducted at room temperature and by using one ATM ultra flat surface.
4. Mitsubishi Material (Major material supplier in Japan) 6/30
The supplier has organized a new division in the U.S. to recycle electronics scraps to collect precious metals.
5. DENSO (Major car module manufacturer in Japan) 7/1
The manufacturer will invest $35.8 million to expand the manufacturing capacity of transmission modules in Mexico to cover the growing market in north America.
6. AIST (R&D organization in Japan) 7/7
The organization has developed a next-generation photovoltaic cell with multiple conjunctions. It combines GaAs and other materials including CIGS and Si.
7. TANAKA (Specialty metal material supplier in Japan) 7/8
The supplier has developed a new screen-printable silver ink paste curable by UV irradiation. It can generate fine lines down to 70 microns.
8. FDK (Major device manufacturer in Japan) 7/8
The manufacturer has commercialized a new SMT-type high power inductor, “MCP Series 2016D,” for mobile products.
9. Toshiba (Major electric and electronics company in Japan) 7/9
The company has unveiled a new sticky sheet type wearable sensor module, “Silmee Bar type." The measured data can be sent directly to a smart phone or tablet PC.
10. Alps Electric (Major device manufacturer in Japan) 7/8
The manufacturer has unveiled the industry's thinnest connector (SCGH1B Series, 0.69 mm high) for micro SD memory cards (PCB cut-off type).
Recent Articles from DKN Research
To view past articles, click here.
Page 2 of 2More Columns from EPTE Newsletter
EPTE Newsletter: Travel to Japan During COVIDEPTE Newsletter: A New COVID Surge in Taiwan?
EPTE Newsletter: COVID-19 PCR Test in Japan
EPTE Newsletter: Japan Failing in Vaccine Distribution
EPTE Newsletter: A Long Trip to the U.S.
EPTE Newsletter: Ten Years After Fukushima
EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers
EPTE Newsletter: The Printed Circuit Industry in China