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Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Material Insight
Column from: Dr. Preeya Kuray
Preeya Kuray is a material scientist. She received her PhD in materials science engineering in 2020 from Penn State, where she authored several peer reviewed publications on polymer dynamics and served as vice president of the Materials Research Society student chapter. She currently works on developing low-loss buildup materials at AGC. She looks forward to sharing insights from PCB veterans while incorporating pieces of her perspective as a material scientist PhD and newcomer to the PCB field.