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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Fein-Lines
Column from: Dan Feinberg
Dan Feinberg is President and CEO of Fein-Line Associates, Inc., a business services and market research consulting firm focused on the electronic interconnect and assembly industries. Dan was a founding Partner in the Quantum Performance Group, LLC, also a market research firm. Dan was formerly president of Morton Electronic Materials (formally Dynachem), a $240 million division of Morton International, Inc., and a group vice president of the parent company Morton International until its acquisition by Rohm and Haas in 1999. He is a 45 year veteran of IPC, was the founding chair of the suppliers council which resulted in the founding of IPC Expo. Dan is presently chairman of the IPC’s Government Relations committee. Dan was recently awarded the IPC Hall of Fame Award for lifetime service to the industry. He has spoken at numerous industry events and has hundreds of published articles, columns and Webcasts. Dan also teaches computer technology for the Cyber Café and lectures on computer use for S.C.O.R.E. His experience in international marketing, mergers and acquisitions and technology based business makes him uniquely suited to assist companies in today’s global, highly competitive environment.