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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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PCB Talk
Column from: Tara Dunn
Tara Dunn is a seasoned professional with more than 20 years in the electronics industry focused on the PCB sector. Her experience spans roles from manufacturing to sales and marketing, and she worked in the flexible board industry for several years before moving to the rigid board side of the industry. As vice president of marketing and business development at Averatek, Tara specializes in technical engagement with the industry, translating new additive PCB technologies to successful PCB design applications. Her specialties include additive PCB processes; rigid, rigid-flex, flexible circuits; RF/microwave PCBs; PCB materials; sales, marketing, and business development; PCB design, and PCB fabrication.