-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
DesignCon Returns to Santa Clara
December 29, 2022 | DesignConEstimated reading time: 2 minutes
DesignCon, the nation's must-attend event for chip, board and systems design engineers, today announces registration for the Jan. 31- Feb. 2 event at the Santa Clara Convention Center is now live. The 2023 expo will host technical paper sessions, tutorials, industry panels, product demos, 120+ exhibits and present some of the industry’s most influential companies, including host sponsor Amphenol and others such as Cadence, Keysight, Molex, Mouser, Samtec, and TE Connectivity.
DesignCon, the premier high-speed communications and system design conference and exposition, will host three days of deeply technical conference opening and two days of exhibition. All conference passholders will have access to 14 tracks of education created by engineers, with more than 100 sessions curated by the 97-person Technical Program Committee, which are expertly reviewed by the advising panel of engineers each year to meet the needs of the ever-evolving industry.
“We could not be prouder to facilitate an outlet where learning is at the forefront for this high-powered industry, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley,” says Suzanne Deffree, Group Event Director of DesignCon. “It is rewarding to connect the industry’s leading professionals with DesignCon as the live hub to showcase creativity and ingenuity that the design engineering trade is bringing to new heights.”
The global engineering and design market is projected to grow to $1.5 Tn by 2023. DesignCon aims to address the main contributors to this market, such as the projected growth of global 5G technology market to $700 B; expected $1.3 Tn value of Internet of Things (IoT) over the next three years; the $519.65 B size of the electronic components market by this coming year; and other areas of growth such as autonomous driving, cables and connectors, EDA software, printed circuit boards, and test and measurement.
DesignCon will also host Drive World for the third year to help advance the automotive sector with access to technical education on automotive electronics and intelligence alongside design engineering content. With the automotive artificial intelligence market projected to grow over 30% from 2021-2026 and expected to reach USD 16.2 Billion in 2026, Drive World’s educational offerings on automotive technology are a must-attend for electrical and mechanical engineers looking help accelerate the path to autonomous driving.
Five webinars will also be available on DesignCon’s digital platform prior to the in-person event for all registered attendees. These webinars, as well as select sessions recorded at the live event, will be available for viewing on the Smart Event platform through the end of February. The digital platform also provides the opportunity to research suppliers and products and network before and after attending DesignCon in Santa Clara, CA.
DesignCon's "Engineer of the Year" Award will also be given during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level. The award winner is selected based on his or her leadership, creativity, and out-of-the-box thinking brought to designing and testing of chips, boards, and systems, with particular attention paid to areas of signal and power integrity. Voting for the 2023 Engineer of the Year Award open December 23, at https://forms.gle/sCYyBL5GwjBgpg1c8.
Registration is now open for all attendees, visit www.designcon.com to get a pass.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Analog Devices Launches ADI Power Studio™ and New Web-Based Tools
10/14/2025 | Analog Devices, Inc.Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella:
Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
10/13/2025 | Cadence Design Systems, Inc.The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI).
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
10/14/2025 | Jesse Vaughan -- Column: Beyond the BoardIn the defense electronics sector, speed-to-market has shifted from being a commercial differentiator to a national security imperative. The ability to move from design concept to deployable system in months rather than years can provide the U.S. with important strategic advantages. Prototyping, once regarded as a costly and optional stage, has become the linchpin for accelerating program schedules while safeguarding performance, compliance, and mission reliability.