Latest News

Ventec’s Martin Cotton to Showcase Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
01/10/2017 | Ventec International Group
Park Electrochemical Names Frank Alberto President of Asian Business Unit
01/09/2017 | Globe Newswire
ESI Showcases Latest Addition to Flex PCB Processing Portfolio
01/09/2017 | Globe Newswire
DYCONEX Successfully Achieves EN 9100:2009 Certification
01/09/2017 | DYCONEX
Isola Signs Distribution Agreement with Tech Knowledge
01/09/2017 | Isola
UniPixel Posts Sequential Revenue Growth of 53% in Preliminary Q4 2016
01/05/2017 | PRNewswire
IPC’s Raymond E. Pritchard Hall of Fame Members Invite PCB Executives
01/05/2017 | IPC
OECD Public Consultation on Due Diligence Guidance for Supply Chain Issues
01/05/2017 | IPC
Silver Nanowire Inks Enable Paper-based Printable Electronics
01/04/2017 | Duke University
Additive Manufacturing: A New Twist for Stretchable Electronics?
01/04/2017 | Missouri University of Science and Technology
Top 10 Most-read PCB Articles of 2016
01/03/2017 | I-Connect007
Top 10 Most-Read PCB News Stories of 2016
12/30/2016 | I-Connect007
I-Connect007 Survey: The Wide World of Flex Circuits
12/28/2016 | I-Connect007
PCB Maker Unimicron Developing SLP Products
12/28/2016 | Digitimes
Ucamco Releases UcamX v2016.12
12/27/2016 | Ucamco
Newly Elected Congressman Discusses U.S. Policy Priorities with Bay Area Manufacturers
12/23/2016 | IPC
N.A. PCB Book-to-Bill Ratio Falls but Sales Growth Resumes
12/23/2016 | IPC
OSHA Issues Recordkeeping Rule Enforcement Memorandum
12/23/2016 | IPC
FPCB Makers Expected to See Weak 1H17 on Slowing iPhone 7 Demand
12/22/2016 | Digitimes
Flexium Announces Share Buyback
12/22/2016 | Digitimes
MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
12/21/2016 | MacDermid Enthone Electronics Solutions
Doosan Electro-Materials BG Signs Distribution Agreement with Arlon EMD
12/21/2016 | Arlon EMD
An Invisible Electrode
12/20/2016 | ICFO
Eltek Signs Definitive Agreement for the Sale of Kubatronik
12/19/2016 | PRNewswire
Experience Technology's Turning Point through IPC APEX EXPO 2017
12/19/2016 | IPC
Flexible Device Captures Energy From Human Motion
12/19/2016 | Michigan State University
AT&S to Present Latest Technologies and Products at Nepcon 2017
12/16/2016 | AT&S
Super-Flexible Liquid Crystal Device for Bendable and Rollable Displays
12/14/2016 | Tohoku University
Flexible Display Shipments to Increase Sharply in 2017
12/13/2016 | IHS Markit
IPC APEX EXPO 2017 to Debut Flexible Hybrid Printed Electronics Pavilion
12/13/2016 | IPC
IPC: Connected Factory Initiative Subcommittee's Progress on Machine Data Interface Standard
12/12/2016 | IPC
CIPSA Circuits Invests in Orbotech Nuvogo 780 and Additional Fusion 22
12/09/2016 | Orbotech
Cartel Electronics Signs Definitive Agreement to Acquire Cirtech
12/09/2016 | Cartel Electronics
Printable Electronics
12/08/2016 | MIT
Nano Dimension Delivers 3D Printer to a Fortune 100 Company
12/07/2016 | Nano Dimension
Orbotech Presents Best-in-Class Industry 4.0-Compliant PCB Production Solutions at HKPCA 2016
12/07/2016 | Orbotech
Holders Technology UK Inks UK Distribution Rights for Acculam Release Film
12/06/2016 | Holders Technology
IPC Study on N.A. PCB Industry Reports Growth in Milaero Market
12/06/2016 | IPC
Orbotech’s Solutions Selected by BOE for World’s First Gen 10.5 FPD Fab
12/05/2016 | Orbotech
IPC Supports EU Skills Agenda
12/02/2016 | IPC
AT&S Receives GoPro Lifesaver Award
12/01/2016 | AT&S
North American PCB Book-to-Bill Ratio Climbs to 1.08 in October
11/29/2016 | IPC
Orbotech Recognized as Deloitte Technology Fast 50 Company
11/29/2016 | Orbotech
Ventec International Group to Focus on High Thermal Performance Materials for Automotive/LED at HKPCA
11/29/2016 | Ventec International Group
Molex Solder on Polyester Substrate Delivers Flexible, Cost-effective Circuitry
11/17/2016 | Business Wire
Lenthor Engineering Releases Q3 2016 Financial Results
11/17/2016 | Lenthor Engineering
Analysis of Current & Emerging Materials Used for Flexible Electronic Substrates
11/16/2016 | Business Wire
PCB Executive Forum Focuses on Critical Issues
11/16/2016 | IPC
Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs
11/16/2016 | IPC
HDP User Group Launches New High Frequency Measurement Project
11/15/2016 | PRWEB
Ventec International Names Chris Bowles Technical Account Manager, USA
11/15/2016 | Ventec International Group
Insulectro Displays Komodo Medical Sleeve at IDTechEx Show
11/15/2016 | Insulectro
From the CEO: Rogers Announces Q3 2016 Financials
11/14/2016 | Rogers Corporation
IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
11/14/2016 | IPC
New Generation of Sensors for Power-Focused Smart Card and Battery Driven Markets
11/14/2016 | NEXT Biometrics
Schweizer Benefits from Auto Sector and Export Business in Q3
11/11/2016 | Schweizer Electronic AG
All Flex Adds Flying Probe Electrical Test Capability
11/09/2016 | All Flex
Sun Chemical to Showcase Wide Portfolio of Solutions for Printed Electronics at IDTechEx 2016
11/09/2016 | Sun Chemical
IPC Releases New Online Training Course, IPC Essentials
11/09/2016 | IPC
UniPixel Management to Exhibit at the 2017 Consumer Electronics Show
11/09/2016 | PRNewswire
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