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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have some M&A news from Summit Interconnect, and a variety of columns. Chris Bonsell discusses the lack of preventive maintenance planning in PCB manufacturing, and Kelly Dack lays out some solder mask guidelines for PCB designers. Duane Benson helps make sense of the quoting process in a time of 50-week lead times, and Dan Beaulieu has a great review of a book about how shareholder policies have caused many of the problems we see in corporations today.

Additive Manufacturing Requires Additive Design Techniques

Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It certainly seems that our times continue to be interesting, don’t they? Just how many different flavors of supply chain disruption can we come up with? Investment on the supply side needs to increase, but the size of the labor force needs to increase even more, if we want to accomplish the task of the buildout itself, let alone running the facilities properly.

DFM 101: Solder Mask and Legend

One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers from the PCB manufacturer’s perspective, and the design decisions that will impact product reliability.

Designing PCBs With Additive Traces

Advances in technology have been clear to see within the component packaging industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. However, while these improvements have occurred with component packages, it has become increasingly more difficult to break out and route the dense circuitry associated with these parts. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the innerlayers of your PCB.

Book Review: 'Advocacy' by John Daly

I’ve always wondered why some great ideas succeed while others fail. Fortunately, I had the opportunity to be both a student of Dr. John Daly and to read his book on advocacy. I highly recommend checking out his YouTube videos as well. He’s an energetic and entertaining speaker.

Designing Additive and Semi-Additive PCBs

With components getting smaller and electronic devices becoming more compact, we are reaching the physical limits of the typical etched fabrication processes. To address these limits, new additive and semi-additive processes are being developed to fit into the current fabricators’ production lines without too much disruption or extra cost.

Addressing the Gap in Process Performance

The first steps in process improvement are to determine what the gap is and why it happens. Having a process is not sufficient; the process needs to be effective as well. For those responsible for creating and maintaining processes, the ultimate goal is to create a procedure that becomes self-perpetuating, that seeps into the fabric of the company’s culture. For better or worse, plenty of procedures do indeed become ingrained in company culture. How does one go about ensuring that company culture is loaded with effective processes that deliver a positive outcome? That is the question, to be sure.

PCBAA Member Profile: Davy Nakada, Rogers Corporation

Our industry has suffered from a lack of visibility with policymakers. PCBAA brings many voices together so those in Washington realize what's at stake. Semiconductors have received the most attention in recent years while the domestic production of PCBs and related PCB materials continues to decline. We are now seeing legislative language supporting domestic production because of how PCBAA has educated lawmakers and policymakers on the PCB’s place in the microelectronics ecosystem.

FIRST Program Inspires Next Generation of Innovators

Today’s students grow up immersed in a world of technology, yet how many of them actually see themselves taking on careers that advance this science? Since many of the jobs for our future workforce haven’t even been created yet, what can be done to encourage students toward STEM careers? In this interview, Barry Matties speaks with Adrienne Collins, director of programs at FIRST Washington, about the success of a student robotics program that fosters innovation, builds problem solving skills, and cultivates a concept that most of us have never heard of—gracious professionalism. When you see the interplay of these skills in action, you are blown away. There’s a bright future ahead.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication, and assembly communities. The roller coaster ride continues, with whiplash-inducing news from IPC about March North American shipment—they’re up from February but down from the same period a year ago.

Catching up with EISO Enterprises’ President Gary Chien

While there are many Chinese companies now selling in the United States, I wanted to find one in Taiwan that is penetrating the U.S. market. I was delighted to come across EISO Enterprise Co. Ltd., a printed circuit board fabricator located in Taiwan. I know that the American companies are usually looking for PCB global partners in countries other than China, which made my conversation with Gary (Jung Kun) Chien all the more interesting, especially when he shared his thoughts on the U.S-China trade wars.

Training the Future Manufacturing Labor Force

To better understand what’s needed for upskilling your labor force in today’s job climate, we reached out to Sunstone Circuits, a PCB fabricator in the Pacific Northwest. We posed our set of questions to individuals in three departments to hear their perspectives depending on what area they work in. The following are the questions and answers from Michael Connella, operations manager; Matt Stevenson, vice president of sales and marketing; and Debra Coburn, human resources manager.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Welcome to April 15, everyone! There are reasons we tend to cover topics in a continuous conversation. First, there are always developments and news in the industry. Second, you dear readers respond to that content by reading it. This week the news items that drew the most reader interest verify that our industry has ongoing interest in government involvement in industry infrastructure, supply chain issues, cybersecurity, and new technologies like additive in fabrication.

The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper

As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints. From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM).

Material Application for Mini Backlight Unit

In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions. One example is the mini backlight unity (MBLU) application material.

Engineering RF Dielectric Material to Enable 5G/6G Antenna Devices

Accurate characterization of frequency-dependent inhomogeneous dielectric material properties is key to the optimal design of high performance and cost-effective PCB antennas. These antennas will be required to enable the plethora of devices forecasted for 5G/6G communication. Therefore IT-88GMW, an advanced resin system reinforced with tightly woven thin glass fibers has been formulated to improve the Q-factor of interconnects and passive components fabricated on PCB laminates.

Uncovering the Electronics Ecosystem

Nolan Johnson speaks with Will Marsh, vice president of TTM Technologies and president of the Printed Circuit Board Association of America, about the work the PCBAA has been doing in Washington, D.C., to get the industry better recognized by the country’s decision-makers. Marsh is optimistic, not only about the companies and individuals joining the effort, but in the recognition by Capitol Hill to secure the nation’s defense systems.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Spring has definitely sprung, and the trade show season continues to roll right along. Managing Editor Nolan Johnson just returned from DesignCon 2022, and as he says in his review, the attendance was up from last year’s event, which had been at the McEnery Convention Center in the waning days of the pandemic. I hope we’re getting back to normal, whatever that means. This week, we have a few articles about Industry 4.0, as well as a column on setting your priorities. We have a cool article about methods for measuring the breakdown of resins during multiple thermal laminations, and a conversation with an EMS company president who realized that he was actually running a data collection firm that happened to make circuit boards. Can you say the same about your own company?

Catching Up With Alpha Circuit’s Prashant Patel

There is plenty of evidence that the American PCB industry is going through a revitalization. While a few new companies are being established, others are being rejuvenated as investors gain more interest and confidence in domestic PCB companies. I reached out to Prashant Patel, owner and president of Alpha Circuit I LLC in the greater Chicago area. I wanted to hear about his investment and the unique path he took to owning a PCB shop.

Measuring Multiple Lamination Reliability for Low-loss Materials

Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customers’ objectives and shows the deterioration of the resin’s physical properties as a result of multiple lamination cycles (up to 10X). This article describes how TUC evaluates the possible change in resin structure due to multi-thermal laminations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

According to a quick look at history.com, “Some historians speculate that April Fools’ Day dates back to 1582, when France switched from the Julian calendar to the Gregorian calendar. In the Julian Calendar, as in the Hindu calendar, the new year began with the spring equinox around April 1.” All well and good, but why April Fools’? “People who were slow to get the news or failed to recognize that the start of the new year had moved to January 1 and continued to celebrate it during the last week of March through April 1 became the butt of jokes and hoaxes and were called “April fools.”

Improved Thermal Interface Materials For Cooling High-Power Electronics

Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

EIPC Technical Snapshot: High-end PCB Market Requirements and Technology Trends

The European Institute for the PCB Community (EIPC) continues to provide an efficient platform for following and pursuing new developments. Its Technical Snapshot webinar has become established as a must-attend monthly event, and consistently delivers essential information of the highest calibre and relevance. The 16th in the series on March 23 focused on market requirements and technology trends at the high end of the PCB and semiconductor packaging industries, with two eminent speakers.

Developments in Low-Loss Substrates for High-Frequency Applications

The electronics industry as we know it today can trace its birth to the creation of the first integrated circuit in 1958, although conception occurred 10 years earlier with the invention of the transistor. That first IC contained a single transistor and four passive components. To say things have come a long way since then is a huge understatement.
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