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Real Time with... productronica 2023: Neil Chamberlain Discusses Polar’s Vast Database
November 21, 2023 | Real Time with...productronicaEstimated reading time: Less than a minute
Neil Chamberlain, European sales manager for Polar Instruments, and Editor Pete Starkey discuss how the company responds to industry's need to analyze a huge variety of materials. Neil explains how Polar has rolled with the punches as the number of materials continues to grow each year.
If you were unable to attend productronica 2023, don't worry. We're bringing you coverage of the week's events in Munich.
Watch this interview below or click here to view on our Real Time with... productronica 2023 show page.
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05/07/2024 | TrendForceTrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
It’s Only Common Sense: Would You Join Your Own Company?
05/06/2024 | Dan Beaulieu -- Column: It's Only Common SenseIn the past few years, I have heard many company runners complaining about their workforce. They tell me that the government is paying people too much money not to work, too many young people are not interested in working every day, and there is just not the work ethic there once was when they were young.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
North American PCB Industry Sales Down 23.8% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.