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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 6, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

It’s the beginning of October and by the end of this month, we launch into the “holiday season”—no matter your country, culture, or spiritual background, there are plenty of holidays to celebrate. Here in the U.S., my adult children refer to this season as “NewHallowsGivingsMasOverZa,” trying to recognize as many holidays as possible. It’s a well-meaning, if somewhat massive and silly, portmanteau.
The I-Connect007 editorial calendar, on a more serious note, is already planning out content into 2024. We’re always interested to hear from you, our readers, with story ideas, news, questions, and the like. Let us know what you like (and maybe don’t like) about our coverage. Tell us what you think we should cover in an upcoming issue of the magazines. Suggest an expert or volunteer your own expertise. Together, we all move the conversation forward in our industry.
This week, our must-read picks include an article on how to build a winning team, IPC’s Alison James’ statement to the EU regarding the vitality of our industry, an overview of test and inspection, greenfield fabrication facility design, and the future of advanced packaging and solder.
Now, whatever holidays, you celebrate, if presents are a part of the traditions, let me gently remind you to pick them out early; a free subscription to I-Connect007 is always a thoughtful gift idea.
Culture by Design: Building a Winning Team from the Start
Published October 5
Before your company can succeed, you need to put together a team that can take you across the finish line. How do you build a winning team? Brian Wallace of HR Strategies Now offers a blueprint for hiring, and keeping, the best employees.
As EU Reviews Risk Assessments of Critical Technologies, IPC Stresses Need for Industrial Policy Approach to Include Complete Electronics Ecosystem
Published October 4
IPC released a report on the “strategic importance of a robust electronics manufacturing industry.” In a statement by Alison James, IPC senior director of European government relations, she wrote: “IPC urges the European Commission to address the alarming strategic dependencies in European electronics manufacturing as part of and independently of the risk assessments on critical technologies announced yesterday. Electronics manufacturing is central to the four critical technologies highlighted in the Commission’s proposal although key segments of electronics manufacturing in Europe have atrophied, undermining the region’s resiliency, security, and economic competitiveness.” To read the entire statement, and to learn how to access the report, click here.
The Knowledge Base: The Role of Automated Inspection Systems
Published October 4
I-Connect007 columnist Mike Konrad opens this group Q&A session by stating: “Automated inspection systems have emerged as a game-changer in this dynamic landscape, offering a level of precision, speed, and consistency that human inspection alone simply cannot match. These systems employ advanced technologies such as machine vision, artificial intelligence, and robotics to meticulously scrutinize electronic components and assemblies, identifying defects and anomalies with unparalleled accuracy.” Readers seemed to find this article quite insightful, based on overall reads. This article appears in the September issue of SMT007 Magazine on test and inspection. To learn more, read the entire issue here.
The End of Solder?
Published September 28
I sat down with Indium Corporation’s Dr. Andy Mackie a couple of months ago and he shared what he sees as emerging answers to that solder question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI. It’s a great read.
GreenSource Engineering: An Eye on Design
Published October 4
Recently, Schweitzer Engineering Laboratories opened its $100 million greenfield fabrication facility. To develop this new captive facility, Schweitzer engaged the services of GreenSource Engineering to assist in the initial design. The GreenSource team—Michael Gleason, Marco Mirkovic, James Brown, and Rick Nichols—representing GreenSource Engineering and GreenSource Fabrication (GSF), discuss their involvement in the project. For more information on the Schweitzer facility, please refer to the September issue of PCB007 Magazine by clicking here.
Suggested Items
PARMI USA Announces New Partnership with Technica USA for Expanded Market Presence
02/13/2025 | Technica USAPARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce a new Distribution and Representative Agreement with Technica USA, marking a significant milestone in the company’s strategy to deliver leading-edge inspection solutions to electronics manufacturers across North America.
Saki Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI
02/12/2025 | Saki CorporationSaki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.
Technica USA Announces New Relationship with PARMI USA in Multiple Markets
02/11/2025 | Technica USATechnica USA announced today that they have entered in a Distribution/Representative relationship with PARMI USA. Working closely with the PARMI USA team, Technica will be responsible for the territories of CA, NV, OR, WA, ID, UT, AZ, NM, CO, WY, TX, OK, AR, & LA.
Incap Slovakia Enhances SMT Quality with Automated Paste Inspection
02/07/2025 | IncapAt Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.
New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
02/06/2025 | IPCA new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.