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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 6, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

It’s the beginning of October and by the end of this month, we launch into the “holiday season”—no matter your country, culture, or spiritual background, there are plenty of holidays to celebrate. Here in the U.S., my adult children refer to this season as “NewHallowsGivingsMasOverZa,” trying to recognize as many holidays as possible. It’s a well-meaning, if somewhat massive and silly, portmanteau.
The I-Connect007 editorial calendar, on a more serious note, is already planning out content into 2024. We’re always interested to hear from you, our readers, with story ideas, news, questions, and the like. Let us know what you like (and maybe don’t like) about our coverage. Tell us what you think we should cover in an upcoming issue of the magazines. Suggest an expert or volunteer your own expertise. Together, we all move the conversation forward in our industry.
This week, our must-read picks include an article on how to build a winning team, IPC’s Alison James’ statement to the EU regarding the vitality of our industry, an overview of test and inspection, greenfield fabrication facility design, and the future of advanced packaging and solder.
Now, whatever holidays, you celebrate, if presents are a part of the traditions, let me gently remind you to pick them out early; a free subscription to I-Connect007 is always a thoughtful gift idea.
Culture by Design: Building a Winning Team from the Start
Published October 5
Before your company can succeed, you need to put together a team that can take you across the finish line. How do you build a winning team? Brian Wallace of HR Strategies Now offers a blueprint for hiring, and keeping, the best employees.
As EU Reviews Risk Assessments of Critical Technologies, IPC Stresses Need for Industrial Policy Approach to Include Complete Electronics Ecosystem
Published October 4
IPC released a report on the “strategic importance of a robust electronics manufacturing industry.” In a statement by Alison James, IPC senior director of European government relations, she wrote: “IPC urges the European Commission to address the alarming strategic dependencies in European electronics manufacturing as part of and independently of the risk assessments on critical technologies announced yesterday. Electronics manufacturing is central to the four critical technologies highlighted in the Commission’s proposal although key segments of electronics manufacturing in Europe have atrophied, undermining the region’s resiliency, security, and economic competitiveness.” To read the entire statement, and to learn how to access the report, click here.
The Knowledge Base: The Role of Automated Inspection Systems
Published October 4
I-Connect007 columnist Mike Konrad opens this group Q&A session by stating: “Automated inspection systems have emerged as a game-changer in this dynamic landscape, offering a level of precision, speed, and consistency that human inspection alone simply cannot match. These systems employ advanced technologies such as machine vision, artificial intelligence, and robotics to meticulously scrutinize electronic components and assemblies, identifying defects and anomalies with unparalleled accuracy.” Readers seemed to find this article quite insightful, based on overall reads. This article appears in the September issue of SMT007 Magazine on test and inspection. To learn more, read the entire issue here.
The End of Solder?
Published September 28
I sat down with Indium Corporation’s Dr. Andy Mackie a couple of months ago and he shared what he sees as emerging answers to that solder question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI. It’s a great read.
GreenSource Engineering: An Eye on Design
Published October 4
Recently, Schweitzer Engineering Laboratories opened its $100 million greenfield fabrication facility. To develop this new captive facility, Schweitzer engaged the services of GreenSource Engineering to assist in the initial design. The GreenSource team—Michael Gleason, Marco Mirkovic, James Brown, and Rick Nichols—representing GreenSource Engineering and GreenSource Fabrication (GSF), discuss their involvement in the project. For more information on the Schweitzer facility, please refer to the September issue of PCB007 Magazine by clicking here.
Suggested Items
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025
03/10/2025 | Koh YoungKoh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
Incap’s Estonian Factory Invests in Innovative X-ray Technology
03/04/2025 | IncapThe electronics manufacturing company Incap Estonia, based in Saaremaa, has enhanced its quality control capabilities with a new high-resolution X-ray system.
Koh Young America Expands Sales Network with Electronic Assembly Products for Colorado and Utah
03/04/2025 | Koh Young AmericaKoh Young America, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the addition of Electronic Assembly Products, Inc. (EAP) as its sales representative for Colorado and Utah, effective March 3, 2025.