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Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron Appoints Mike Cordano as Executive VP of Worldwide Sales

01/06/2025 | Micron
Micron Technology, Inc. announced it is appointing Mike Cordano as the company’s executive vice president of worldwide sales, effective immediately. Cordano will succeed Mike Bokan, who announced a few months ago his intention to retire from Micron in fiscal 2025 after more than twenty-eight years with the company.

American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium

01/06/2025 | American Standard Circuits
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.

HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications

01/06/2025 | BUSINESS WIRE
HaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.

MicroCare Welcomes Greg Gascon as Strategic Account Executive

01/06/2025 | MicroCare, LLC
MicroCare, LLC, a global leader in critical cleaning solutions, is excited to announce that Greg Gascon has joined the team as a Strategic Account Executive.
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