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Real Time with... SMTAI 2024: SMTA Austin on the Grow

11/04/2024 | Real Time with...SMTAI
In this interview from SMTAI 2024, Nolan Johnson chats with SMTA Austin Chapter Treasurer Brad Pagano, who shares what he's learned in his first 10 months of board service with this growing chapter. His insights are good advice for board members in other chapters.

CEE PCB to Exhibit at Electronica 2024

10/31/2024 | CEE PCB
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.

Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs

10/31/2024 | Team NCAB -- Column: Fresh PCB Concepts
PCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Counterfeit Concerns: Navigating the Risks

10/23/2024 | Nolan Johnson, SMT007 Magazine
Nolan Johnson meets with Diganta Das, PhD, and Michael Azarian, PhD, research scientists at the CALCE Electronic Products and Systems Center at the University of Maryland, to discuss the increasing issue of counterfeiting in the electronics and assembly industry. Diganta and Michael highlight the need for robust detection methods and standards to mitigate risks, specifically referencing SAE AS6171 for inspection and AS5553 for counterfeit mitigation. They cover real-world cases, like counterfeit network equipment scandals to relatively simple issues of consumer electronics accessories to illustrate the complexity of the issue and debate the philosophical implications of labeling products that contain a few minor counterfeit components as “counterfeit.”
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