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Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions

12/26/2024 | Compal Electronics Inc.
Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.

GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25

12/18/2024 | TrendForce
As the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.

Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens

10/14/2024 | Bransys
Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.

NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,

09/23/2024 | TrendForce
TrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.
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