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HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models

10/30/2024 | TrendForce
TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development

10/30/2024 | DuPont
DuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.

ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing

10/30/2024 | JCN Newswire
ULVAC, Inc., the world’s leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.

Nokia, Chunghwa Telecom Prepare for 5G-Advanced Era with Expansion Deal

10/29/2024 | Nokia
Nokia announced that it has been selected by Chunghwa Telecom (CHT), in a one-year extension deal that will modernize its 5G network across the central and southern regions of Taiwan.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
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