Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Estimated reading time: Less than a minute
Zulki's PCB Nuggets: EMS Discovers Mature IC Technologies
Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers. For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly a lot of OEMs are using them in their advanced products; others are quickly coming on board. But I’m not talking about those. The ones I’m talking about are some more recent ones that EMS companies have recently discovered, while PCB technology has been evolving at such a rapid pace. The technologies coming to our attention are:
- Wire bonding;
- Ribbon bonding;
- Die bonding;
- Extraordinarily fine-pitch 0.25-mm pitch BGAs;
- Buried resistance/buried capacitance; and
- Chip on board or CoB.
Read the full column here. Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine.
Share on:
More Columns from Zulki's PCB Nuggets
Zulki's PCB Nuggets: Cleanliness is Next to ReliabilityZulki’s PCB Nuggets: Thermal Compression Bonding for Extra Fine Pitch Flip Chips
Zulki’s PCB Nuggets: WBAN Steps Into PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Photonics Comes to PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Sub-Micron Die Bonding—Don’t Be Misled by Five Micron Placement Standard
Zulki’s PCB Nuggets: Meet the New Player in PCB Microelectronics Assembly—Interposers
Zulki’s PCB Nuggets: How Effective Is Your PCB Microelectronics Assembly?
Zulki’s PCB Nuggets: Five Key Benefits for Onshoring PCB Microelectronics Assembly