-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 4 minutes

FINETECH JAPAN 2016
Headlines of the week1. Toshiba (Major electric and electronics company in Japan) 3/24
Will provides know-how of the cell manufacturing solution “Meister MES” for the next generation production system. It will increase productivities and yields.
2. Omron (Major device manufacturer in Japan) 3/29
Will commercialized a new precious optical shift sensor with a micron class
accuracy. It can detect the shift in a short time.
3. NEDO (Major R&D organization in Japan) 3/28
Has co-developed the basic energy storage system with Kyoto University. The new system has a higher performance than traditional lithium ion batteries.
4. Tohoku University (Japan) 3/29
Has developed a new smart network technology with high-speed readable hard disc memories. It could be reliable during big disasters.
5. Taiyo Yuden (Major component supplier in Japan) 3/31
Has commercialized new advanced Bluetooth Smart modules, EYSHCNZXZ and EYSHJNZXZ Series for IoT modules of wearable and medical devices.
6. DNP (Major printing company in Japan) 3/31
Has developed a new transparent high barrier film using a special vacuum deposition process for display panels and photovoltaic cells.
7. Hamamatsu Photonics (Major optical device manufacturer in Japan) 4/4
Had a ground breaking ceremony for the construction of the new manufacturing plant in Hamamatsu City to expand the capacity of opto-semiconductor devices.
8. Sharp (Major electronics company in Japan) 4/4
Has commercialized new cloud power storage systems with lithium battery devices and hybrid power conditioners for home use.
9. TANAKA (Specialty metal product supplier in Japan) 4/4
Has developed a new high power LED module introducing a new low-temperature welding alloy “AuRoFUSE”.
10. HEPCO (Major electric power supply company in Hokkaido) 4/5
Will start field testing for the small scale electric power generation system with biomass fuels.
To read back issues of the newsletter, click here.
To reach Dominique K. Numakura, click here.
Visit DKN Research here.
Please contact haverhill@dknreseach.com for further information on the news included here.
Page 2 of 2More Columns from EPTE Newsletter
EPTE Newsletter: Travel to Japan During COVIDEPTE Newsletter: A New COVID Surge in Taiwan?
EPTE Newsletter: COVID-19 PCR Test in Japan
EPTE Newsletter: Japan Failing in Vaccine Distribution
EPTE Newsletter: A Long Trip to the U.S.
EPTE Newsletter: Ten Years After Fukushima
EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers
EPTE Newsletter: The Printed Circuit Industry in China