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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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The New Chapter
Column from: Hannah Grace & Paige Fiet
Hannah Grace Hannah is a Validation Engineer at Texas Instruments - Tucson, AZ. Hannah graduated from Valparaiso University in 2023 with a degree in Electrical Engineering. While at Valpo, Hannah served on the IPC Board of Directors as the Student Director and was a recipient of the VUAA Distinguished Student Award for the College of Engineering. Hannah was also involved in her IPC and IEEE student chapters. She is in her third year of the IPC's Emerging Engineer program.
Paige Fiet works as a process engineer at TTM-Logan. Paige graduated from Michigan Technological University in 2021 with a bachelor's in electrical engineering. While at MTU, Paige served as IPC’s Student Liaison to the Board of Directors and as president of the IPC and Electronics Club. She now serves as co-chair of the Solder Mask Committee and is in her third year of IPC’s Emerging Engineer Program.