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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Bert's Practical Design Notes
Column from: Bert Simonovich
Bert Simonovich was born in Hamilton, ON, Canada. He received his Electronic Engineering Technology diploma from Mohawk College of Applied Arts and Technology, Hamilton, ON, Canada in 1976. Over a 32-year career, working as an Electronic Engineering Technologist at Bell Northern Research and later Nortel, in Ottawa, Canada, Bert helped pioneer several advanced technology solutions into products. He has held a variety of engineering, research and development positions, eventually specializing in signal integrity and backplane architecture for the last 10 years. He is the founder of Lamsim Enterprises, Inc., where he continues to provide innovative signal integrity and backplane solutions to clients as a consultant. With three patent applications and two patent grants to his name, Bert has also (co)authored several publications, including an award-winning DesignCon2009 paper related to PCB via modeling. His current research interests include signal integrity, high-speed characterization, and modeling of high-speed serial links associated with backplane interconnects