-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
E-Mobility a Driver of Topics at IPC APEX EXPO
December 9, 2022 | Sandy Gentry, IPCEstimated reading time: 1 minute
E-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e-Mobility presents new challenges that the electronics supply chain is working together to resolve.
You can find the latest information on e-Mobility at several technical sessions at IPC APEX EXPO 2023.
The IPC APEX EXPO Technical Conference will host an engaging special session focused on e-Mobility touching on supply chain and technology issues. The e-Mobility Special Session includes speakers and panelists from Rivian. Overall, the technical conference offers many technical papers advising on assembly and design for high reliability. A few highlights include
- S02: EX 1- High Reliability for Extreme Environments 1 including a paper by Dr. Walter Olbrich, TTM Technologies, titled “Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness”
- S06: EX 2- High Reliability for Extreme Environments 2 with a presentation from Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
- S23 EM3-C&C Electronic Materials Cleaning and Coating 1 including a paper from Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH on “Investigation of the Electrochemical Reliability of Conformal Coatings under High Voltage
- S25: QRTI-Assembly Risk Prediction and Failure Analysis including a paper, “Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation,” by Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
IPC standards development task groups will be diligently working to advance manufacturing and design standards in the areas of high voltage. The test methods task group will celebrate the release of the new test method for high voltage testing. Task groups of interest are the 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum, 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group, D-33AA: IPC-6012 Automotive Addendum, or 5-21M: Cold Joining/Press-fit Task Group.
Professional Development Workshops take place on Sunday, January 22, and Monday, January 23, including PD28: Press-fit Technology - Value Chain, Physics, Process and Standards which provides insight into the production, design, and application of compliant press-fit pins and components as well as new materials and surface finish technologies.
In addition, of interest to those electrifying and advancing systems within vehicles, IPC is hosting an E-Textiles Conference, collocated with IPC APEX EXPO on Sunday January 22.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Ethiopian Airlines Selects Cassiopée Alpha from Safran for Fleet-wide Flight Data Monitoring
11/03/2025 | SafranSafran Electronics & Defense is proud to announce that Ethiopian Airlines has selected Cassiopée Alpha, its advanced flight data analysis platform, to optimize and secure operations across the airline’s entire fleet of 147 aircraft, including Airbus A350, Boeing 787, and Boeing 737 MAX models.
SMT007 Magazine November 2025: Inside Mexico’s Rise as an Electronics Manufacturing Leader
11/03/2025 | I-Connect007 Editorial TeamMexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. In this issue, we uncover why Mexico is earning global recognition. From top-ranked manufacturing capabilities to expanding partnerships that reach far beyond the U.S.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.