Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
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Rigid-flex DFA
Rigid-flex assembly brings its own set of issues, but designers can do quite a bit to make things easier on their downstream brethren. We asked IPC instructor Kris Moyer to give us the lowdown on DFA for rigid-flex circuitry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’ve had a hot week in this industry. In my picks for this week, we introduce a new SMT007 columnist, and we have a look at the CHIPS Act one year later. We have a great article about sourcing diversification, and a look at the latest electronics news coming out of India. And columnist Vern Solberg explains DFM best practices for flexible circuits.
An Overview of Rigid-flex Design
For this month’s issue on rigid-flex design, we spoke with instructor Kris Moyer, who teaches the IPC class “PCB Design for Flex and Rigid-Flex Boards.” In this wide-ranging interview, Kris breaks down the hurdles facing rigid-flex designers and offers a variety of solutions for rigid board designers taking on their first rigid-flex circuits. He also provides a few horror stories to illustrate what happens if you don’t follow sound design practices, rules, and standards. And, as Kris points out, “Your fabricator is your friend.”
A Look Inside SEL’s New PCB Factory
After years of planning, Schweitzer Engineering Laboratories is now manufacturing printed circuit boards in its new $100 million captive facility in Moscow, Idaho. I recently toured the facility with Engineering Director John Hendrickson, who managed the design and setup of the greenfield site, along with Mike Brask, president of Integrated Process Systems (IPS), a key supplier for the new Moscow facility.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we have an article about flex-hybrid electronics, which the military and aerospace folks are following closely. We have an article about the digital twin and what it is—and what it’s not. We have 10 outside-the-box ideas for closing the deal—be sure to forward this to your sales team. John Perry brings us an interview with a father/son team of IPC volunteers. (Would you want your children to work in this industry?) Finally, John Watson discusses AI, simulation and SPICE, and what they have to offer for PCB designers.
Stiffeners for Flex Circuits
One of the most recent topics in the flex world has been the evaluation of materials required to build a rigid-flex or flex circuit. Discussions around flex and materials include variations of polyimide and copper. Here I will discuss another material that plays a very important role in the world of flex circuits: stiffeners. These are critical components to a flex circuit because they broaden its scope and potential applications.
Designing and Manufacturing Wearable Biosensors
As wearable electronic devices continue to be more prevalent, it’s an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important that each device is effective, cost-efficient, and of the highest quality available.
PCB Technologies Invests in Advanced Packaging
Jeff De Serrano, president of PCB Technologies North America, gives an update on the company’s recent move into advanced packaging—a move that stemmed from company leadership and vision for the future. He also shares his forecast on the PCB market, specifically around rigid-flex, along with some of the challenges the industry still faces.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been hot in PCB design and manufacturing this week! In this wrap-up, we have an article about safeguarding electronics manufacturing workers from hazardous chemicals, and another about additive processes’ green benefits. Kelly Dack discusses how to keep your design on the road through proper tolerance management, and Joe Fjelstad explains why the next big invention is just one step away from what currently exists, the “adjacent possible.” And Dan Beaulieu, never one to shy away from a controversial topic, explains why now is the time for your sales team to do some old-fashioned, in-person sales calls.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s a heady time here in the U.S. between the summer holidays of Memorial Day (last Monday in May) and Independence Day (July 4). This four-week period straddles the Northern solstice, boasts the longest days of the year in the Northern Hemisphere. This is the high season for outside activities, which may be pulling you away from the office. Am I right? Never fear, I-Connect007 is here to deliver the “must know” news stories.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 21 marked the first official day of summer, and it’s the longest day of the year. I’m wearing by best Hawaiian shirt right now. But we’ve been too busy to hit the beach yet. There’s a lot going on in our industry right now. In this week’s Top 5, we have our coverage of the recent SMTA Oregon Expo & Tech Forum, a show that drew a good crowd of technologists.
Rigid-flex, Rigidized Flex, or Hybrid Flex?
In a recent interview with Design007 Magazine managing editor Andy Shaughnessy, he asked me about rigid-flex and its new popularity. This seems like a perfect opportunity to dig into the topic and discuss the differentiation between rigid-flex, rigidized flex, and what I am calling a hybrid flex.
Challenges of DFM Analysis for Flex and Rigid-Flex Design, Part 3
DFM analysis tools for the last several decades have focused on a typical rigid PCB or some variant. While many standard DFM constraints are applicable, flex has many unique requirements that cannot be addressed with typical DFM analysis.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week has been both speedy and newsy. Of course, those two characteristics often seem to travel as a pair, don’t they? A four-day week here in the United States, accompanied by a wave of high-impact news from a wide variety of sources, would suggest that readers could be expected to spread out all over the news map. Not so much, judging from readership numbers; folks all found their highest value in the same type of news coverage. This week's list of must-reads is dominated by market reports as a result of that focused readership. On our list, we have PCB fabrication and EMS book-to-bill reports, a 10-year market forecast report, and a supply chain sentiment report. In addition, readers flocked to the EWPTE show coverage. Finally, we saw significant reader interest in the most recent podcast on sustainability in our logistical operations.
Selecting Flex Materials: Do Your Homework
While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit. Material choices affect not only the design of the circuit for its environment, but also the manufacturing and assembly processes. While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit.
Challenges of DFM Analysis for Flex and Rigid-flex Design, Part 2
Everyday rigid FR-4 PCBs have a well-known layer stackup recipe: dielectrics, PCB conductor layers, plane layers, mask, and silkscreen (nomenclature or legend). More advanced layer types may include embedded or screened components or cavities with bonded bare die. Flex and rigid-flex stackups include those similar to rigid PCBs, such as dielectrics, conductor, mask, and silkscreen layers, but that is where the similarity ends. There are many additional layer types present for this genre of PCB. They include types like coverlay, adhesive, conductive film, conductive foil, conductive adhesive, bondply, and stiffener.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s must-reads contains a veritable potpourri of information from around the industry. We have a Pete Starkey review of the latest EIPC webinar on ultra HDI and thin film resistors, an interview with the founder of an electronics trade school in Texas, and an update from PCBAA about their lobbying efforts in Washington. We also have news about our brand-new podcast, or “pod,” as the kids say, and a column about the wisdom of Don Draper that just might serve technologists and managers well. Read on, folks!
Flex, Rigid-flex, and Rigidized Flex: What’s Right for You?
I recently spoke with Mike Morando, director of sales and marketing for PFC Flexible Circuits and a contributor for Flex007. I asked Mike to discuss the latest innovations at PFC, as well as some of the trends he’s seeing in flex and rigid-flex circuits now. Mike also discusses rigidized flex, a technology that is an alternative to rigid-flex circuits—one that can save customers up to 20% compared to rigid-flex. Innovation in the flex arena never seems to stop.
NextFlex Calls for 3D Imaging Technology Proposals
Nolan Johnson talks with Scott Miller about a special call for proposals which NextFlex currently has open to explore methods to dewarp 3D scans of physical boards to enable multi-image scans to be stitched together. There is the possibility of funding for viable proposals. Deadline is May 15, 2023.
I-Connect007 Launches 'On the Line with...' Podcast with Series on Sustainability
Expanding its avenues of content delivery, I-Connect007 is excited to announce the launch of our latest educational product, On the Line with.., available on Spotify, Apple and all the major podcast platforms. In this podcast, we speak with industry experts to get the latest insights and perspectives on the most relevant topics in the electronics industry today.
DownStream Discusses Rigid-flex and DFM Trends
I recently sat down with Joe Clark, founder, and Ray Fugitt, technical marketing manager, of DownStream Technologies to discuss trends in tool design and manufacturing, including rigid-flex design and refreshed graphical user interfaces (GUI).
RF Antenna Design and Layout Tips for Your PCB
These days, it’s hard to think of a consumer product that doesn’t contain an antenna. Even my garage door opener can connect to my phone via Bluetooth or Wi-Fi. Each time a new RF antenna gets added to a PCB layout, it can create a new headache for RF designers, especially as analog design skills start to become critical again. With so many RF capabilities being added to new PCBs, how can designers ensure the signals in their system are not corrupted and signal integrity is preserved?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
How was your week? We’ve been pretty busy ourselves, bringing you coverage of the SMTA Expo & Tech Forum in Boise, Idaho. Tabletops shows like this offer a great value during the spring, in between the bigger shows like IPC APEX EXPO and SMTA International. In fact, SMTA schedules approximately 30 regional shows around the United States and abroad.
DFM Analysis for Flex and Rigid-flex Design, Part 1
Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Texans like to say that everything is bigger in Texas. That certainly seems to be the case for the SMTA Dallas Expo & Tech Forum. Publisher Barry Matties and I attended SMTA Dallas on Tuesday, and the tabletop show has now grown to 100 exhibitors, up from 92 vendors last year. It’s become more than a local or regional show, with some exhibitors flying in from Silicon Valley and the East Coast.
A Quantic Leap into Foils and Embeddeds With John Andresakis
Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.
Nick Koop: A Commitment to Lifelong Learning
Nick Koop, director of flex technology at TTM Technologies, reflects on the powerful impact the electronics manufacturing industry has had on the world, as well as the many learning opportunities offered by actively participating in IPC. Nick urges aspiring young professionals to reach out and create the lasting connections that will guide them throughout their careers.
A Week-long Industry Extravaganza
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.
Real Time with... IPC APEX EXPO 2023: Arlon's Growth Continues
In this interview, Andy Shaughnessy meets with Mark Carlson, global OEM marketing manager for Arlon EMC, to discuss Arlon’s expansion and integration with EMC, as well as products they are releasing in 2023.
Real Time with... IPC APEX 2023: Flex Innovation
Casey Krueger from MKS Instruments speaks with Andy Shaughnessy about increasing yields and via quality in high-volume production manufacturing. They also discuss innovations in flex and improving the material work surface to increase via quality, and their integration with MKS’ Atotech, a company MKS acquired in 2021.
Real Time with... IPC APEX EXPO 2023: Flat Flex Cable a Potentially Disruptive Idea
Managing Editor Andy Shaughnessy and Jason Michaud, VP of sales and marketing for Miraco, discuss the company's flat flex cable, which could replace the flexible circuit in certain situations. Jason explains why the company is happy to offer customers less expensive options, even if it costs them money in the short run.
Real Time with... IPC APEX EXPO 2023: Positioning in the Market
Mycronic’s Kevin Clue shares with guest editor Jesse Vaughan new innovations in Mycronic AOI and their position in the dispensing/coating equipment market. As a leading global partner for flexible PCB assembly solutions, Mycronic continues to respond to growing customer demand for standardized software integration and state-of-the-art inspection technologies. In addition to PCB assembly, jet printing, dispensing, coating and material handling solutions, the company has introduced major advances in 3D inspection technologies and factory connectivity.
Don't Blink: The IPC APEX EXPO Time-lapse
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
IPC APEX EXPO Wrap-up
IPC APEX EXPO 2023 is over, and I think it was a successful show no matter how you slice it. There was barely a break in traffic on the show floor on Tuesday and Wednesday, and even on Thursday I saw people sprinting to close one more deal. Some committee meetings had nearly 200 participants; the meetings I sat in on were anything but boring.
Classes and Meetings Under Way at IPC APEX EXPO
IPC APEX EXPO 2023 doesn’t officially kick off until Tuesday, but there’s plenty of action going on here at the San Diego Convention Center. Booths are sprouting up on the show floor, and exhibitors are starting to arrive. Upstairs, committee meetings have been taking place all weekend; the IPC-J-STD-001 and IPC-A-610 Joint Task Group, and IPC-A-600 and IPC-6012 Joint Task Group meetings, were abuzz with activity. The Professional Development classes began on Sunday, covering everything from design through assembly processes, flex and rigid-flex, and technologies of the future.
It’s Here: The Launch of IPC Community Magazine
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“New year, new you.” That tagline seems to be everywhere right now. All five must-reads this week reflect this theme. Does this apply to you and your company? We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
'Happy New Year' Celebrations Around the World
New Year’s Eve is tomorrow, and 2023 is around the corner. Where did the time go? That’s the $64,000 question. We celebrate New Year’s Day, in part, to help us mark the passage of time—sort of a shared experience for the human race. Humans have been celebrating New Year’s Day for thousands of years, but the party really took off in 45 BC, after Julius Caesar revamped the Roman calendar. From that point until the middle of the 18th century, New Year’s Day in Europe fell on a variety of days, including Dec. 25, March 1, and March 25. Andy Shaughnessy gives us the details.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy. There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.
Web vs. Direct Imaging
As flexible printed circuits (FPC) continue making waves in PCB manufacturing, the Altix team of Alexis Guilbert, Damien Boureau, and Alexandre Camus look at today’s use cases for FPCs, and detail the finer points of roll-to-roll technology vs. direct imaging. For example, how long can a flexible circuit be? Which technology works best with extremely long circuits, and how does a customer know which one to use? The I-Connect007 Editorial Team explores these trending topics and what it means for PCB manufacturers.
DownStream Flexes in Rigid-Flex
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re officially in show season and Managing Editor Nolan Johnson just got back from SMTA International. As he says in his review, the show drew a sizeable crowd this year. With the pandemic in the rear-view window, let’s hope our trade shows are getting back to normal.
The Printed Electronics Roundtable, Part 3
We recently conducted a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies.
In this third and final installment of the roundtable, these experts discuss some of the differences and similarities between PEC and traditional PCB processes, the future of printed electronic circuits, and why the best way to learn about this technology is through networking with veterans of this segment who are eager to share their expertise with the next generation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
Sunstone and I-007eBooks Launch Book on Designing for Reality
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality. This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Market and Tech Convergence: Electrically Conductive Inks
It’s no secret that electronics products are being asked to do more, pushing the boundaries of technological capabilities. Next-gen consumer products like flexible wearables and foldable mobile devices are proving themselves to be more than a fad, with start-ups and major companies alike booming on the market for the past few years.
The Chip Shortage Leads to Innovation
The chip shortage is by no means over, with estimates expecting it will last into 2023. Some could see it taking even longer, such as Intel CEO Pat Gelsinger, who expects it to see shortages into 2024 due to those now impacting electronics production equipment. But if there’s any bright spot to be had, it’s that a crisis often leads to long-term solutions. In this case, it’s the increase in government funding for semiconductor production in the United States. Once the CHIPS Act proceeds, we can significantly accelerate building semiconductor fabs in the United States and work toward preventing future chip shortages that would put us back into our current situation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.
Part 2: The Printed Electronics Roundtable
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The CHIPS Act continues to captivate the attention of industry insiders, as evidenced by the reader interest in our U.S. legislation coverage. When talking with all of you, we hear a wide range of opinion regarding the CHIPS Act funding, ranging from enthusiasm to cynicism—sometimes in the same conversation with the same person. You can expect ongoing coverage as news continues to unfold. Advanced packaging and the CHIPS Act are increasingly being linked together on the printed circuit side of the industry conversation. Perfect timing, then, that IPC is hosting a symposium on advanced packaging October 11-12 in Washington, D.C.
FCT: Powerful Growth in the Flex Segment
After the initial impact of the global pandemic led to a somewhat flat 2020, Carey Burkett, vice president of Flexible Circuit Technologies, explains how the company’s growth took off in 2021, positioning it well for industry trends that continue to show great promise in medical, automotive, consumer, and more. In this interview, Carey breaks down the reasons behind the company’s recent success and how R&D, and a new Zhuhai facility, have positioned them for continued growth.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week we have quite a variety of articles for you. There has been so much electronics industry news coming out of Washington, D.C., that it can be hard to keep track of what’s going on. So, Editor Michelle Te compiled a handy-dandy reference guide to recent legislation news, including our exclusive coverage. We need to keep an eye on these senators and representatives. They’ve been talking about the importance of our industry for the past year, but this is an election year, after all. They’ve been known to say one thing and do another.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Myths vs. Facts: The Printed Electronics Roundtable, Part 1
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this first part of the roundtable, the participants dispel 10 common myths that have been floating around regarding printed electronic circuits (PEC). They also discuss the progress that’s been made in PEC development in just the past decade, and what the future may hold for this technology.
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