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Latest News

Spirit Electronics Adds MIL-STD-883 Test Services with DLA Commercial Lab Suitability
03/23/2022 | Business Wire


Hentec/RPS Appoints LaPa Enterprises as Northern California Sales Representative
03/23/2022 | Hentec Industries/RPS Automation




Kimball Electronics Announces Retirement of Sandy Smith, VP, Information Technology
03/18/2022 | Kimball Electronics





Nordson Sponsors New Innovation Lab for Engineering at California State University at San Marcos
03/17/2022 | Nordson Corporation

Rehm Ensures Sustainable Condensation Soldering with the Closed-loop Principle and Active Galden Filtering
03/17/2022 | Rehm Thermal Systems


Teledyne Labtech Announces New Advanced Graphite Embedding Capability for PCB Thermal Management
03/16/2022 | Business Wire





Hentec/RPS to Exhibit at SMTA Dallas Expo & Tech Forum
03/15/2022 | Hentec Industries/RPS Automation
SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements
03/14/2022 | SHENMAO America, Inc.
MacDermid Alpha Launches ALPHA OM-565 HRL3, Next Generation, Low Melt Point Solder Paste
03/10/2022 | MacDermid Alpha Electronics Solutions
Indium Corporation to Feature Liquid Metal Thermal Solutions at SEMI-THERM
03/10/2022 | Indium Corporation
Cybord Raises $4M Seed Investment Led by IL Ventures to Disrupt the Electronics
03/08/2022 | PRNewswire
Jabil Photonics, EFFECT Photonics to Co-Develop Next-Generation Coherent Modules
03/08/2022 | Jabil Circuit Inc.
Indium Features High-Reliability Products for Power Electronics at CIPS
03/04/2022 | Indium Corporation
KYOCERA AVX Components to Acquire ROHM’s Tantalum and Polymer Capacitor Business Assets
03/04/2022 | KYOCERA AVX
INSPECTIS’ New F35 Full HD Digital Microscope Offers Superb Imagery, Features, Ergonomics
03/03/2022 | INSPECTIS
Benchmark Invests in New Photonics Packaging and Integration Capabilities
03/03/2022 | Benchmark Electronics Inc.
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