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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Latest News
Concepcion Industrial Forms IoT Strategic Alliance with Ionics
04/07/2016 | Concepcion Industrial Corp.
ACE to Conduct May 3-4 Advanced Selective Soldering Workshop
04/06/2016 | ACE Production Technologies Inc.
Indium to Showcase Indium8.9HF Solder Paste Series at SMT Hybrid Packaging 2016
04/06/2016 | Indium Corporation
Vizion Solutions Receives 2015 Partner of the Year Award from Libra Industries
04/05/2016 | Libra Industries
BTU’s Fred Dimock to Discuss How to Reduce Reflow Costs at SMTA Monterrey
04/05/2016 | BTU International, Inc.
AIM’s Dillon Zhu to Present White Paper at SMTA China East Technical Conference
04/04/2016 | AIM Solder
Nordson to Showcase Test and Inspection Systems at SMT/Hybrid/Packaging 2016
04/04/2016 | Nordson DAGE
Saki and Fuji Connect to Improve PCB Manufacturing Productivity and Efficiency
03/31/2016 | Saki Corporation
Beyond Cable and PCB Testing: ECT Test Fixtures for Final QA
03/31/2016 | Everett Charles Technologies
ACE Receives NPI Award for its JEDEC Tray-to-Tray Lead Tinning System
03/31/2016 | ACE Production Technologies Inc.
BTU’s Fred Dimock to Present Solder Reflow Fundamentals During SMTA Webtorial
03/30/2016 | BTU International, Inc.
BTU’s Fred Dimock to Present Solder Reflow Fundamentals at SMTA Webtorial
03/30/2016 | BTU International, Inc.
FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering
03/30/2016 | FCT Assembly
Alpha Assembly Solutions to Present at 2016 IPC Assembly and Reliability Conference
03/29/2016 | Alpha Assembly Solutions
Newbury Electronics Supports NOC to Discover More about the Deep Sea
03/29/2016 | Newbury Electronics
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