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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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The New Chapter
Column from: Hannah Grace & Paige Fiet
Hannah Grace Hannah is a Validation Engineer at Texas Instruments - Tucson, AZ. Hannah graduated from Valparaiso University in 2023 with a degree in Electrical Engineering. While at Valpo, Hannah served on the IPC Board of Directors as the Student Director and was a recipient of the VUAA Distinguished Student Award for the College of Engineering. Hannah was also involved in her IPC and IEEE student chapters. She is in her third year of the IPC's Emerging Engineer program.
Paige Fiet works as a process engineer at TTM-Logan. Paige graduated from Michigan Technological University in 2021 with a bachelor's in electrical engineering. While at MTU, Paige served as IPC’s Student Liaison to the Board of Directors and as president of the IPC and Electronics Club. She now serves as co-chair of the Solder Mask Committee and is in her third year of IPC’s Emerging Engineer Program.