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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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The New Chapter
Column from: Hannah Grace & Paige Fiet
Hannah Grace Hannah is a Validation Engineer at Texas Instruments - Tucson, AZ. Hannah graduated from Valparaiso University in 2023 with a degree in Electrical Engineering. While at Valpo, Hannah served on the IPC Board of Directors as the Student Director and was a recipient of the VUAA Distinguished Student Award for the College of Engineering. Hannah was also involved in her IPC and IEEE student chapters. She is in her third year of the IPC's Emerging Engineer program.
Paige Fiet works as a process engineer at TTM-Logan. Paige graduated from Michigan Technological University in 2021 with a bachelor's in electrical engineering. While at MTU, Paige served as IPC’s Student Liaison to the Board of Directors and as president of the IPC and Electronics Club. She now serves as co-chair of the Solder Mask Committee and is in her third year of IPC’s Emerging Engineer Program.