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Current IssueThe Registration Sweet Spot
Registration is underrated and underappreciated. The key is to ensure proper registration from layer to layer across the entire printed circuit board. It’s a holistic process requiring anticipation, prediction, precise attention at each step, and detailed data tracking and monitoring.
High-reliability Fabrication
In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication.
Finding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
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Luca Gautero, SÜSS MicroTec
Exploring the many opportunities and challenges offered by inkjet as an advanced method of solder mask application.
Latest Column: Additive Reality: Drop It, and Enjoy the Greenback

Travis Kelly, PCBAA
This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.
Latest Column: American Made Advocacy: What We Learned at PCB West

Marc Carter, Aeromarc LLC
This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.
Latest Column: Better to Light a Candle: A Solid Training Ground in New Hampshire

Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: Just a Matter of Time

Kim O'Neil, Prototron Circuits
Kim discusses the daily challenges of running an American PCB fabricaton facility.
Latest Column: Circuit Chronicles: It’s All About the Team

Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: The Entrepreneurial Brain

Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Simplify PCB Documentation

Dennis Fritz, Fritz Consulting
Dennis covers military and defense industry topics and applications.
Latest Column: Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems

Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designer’s Notebook: DFM Principles for Flexible Circuits

Dominique Numakura, DKN Research
Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.
Latest Column: EPTE Newsletter: Travel to Japan During COVID

Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: The Road Less Traveled—Working From Home or the Office?

Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: The Simplest Way Is the Best Way

IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Student-focused Professional Enhancement Opportunities

Bob Duke, American Standard Circuits
Bob offers advice on the most important aspects of global sourcing.
Latest Column: Global Sourcing Spotlight: Get Out of China? It’s Quite Complex

Happy Holden, I-Connect007
Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.
Latest Column: Happy’s Tech Talk #23: Large Panel Processing

Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense: A Step-by-Step Guide to Problem-solving

Marc Ladle, Viking Test Ltd.
Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.
Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?

John Coonrod, Rogers Corporation
John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.
Latest Column: Lightning Speed Laminates: Millimeter-wave Properties and PCB Design Challenges

Preeya Kuray, AGC Multi Material America
This column discusses the impact of global affairs on PCB R&D in America, as well as the growing intersection between the PCB and chip packaging industries.
Latest Column: Material Insight: A Conversation with Congressman Blake Moore

Doug Sober, Essex Technologies Group
Doug writes about the problems of & concerns with PCB laminate materials and their specifications.
Latest Column: Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out

Nolan Johnson, I-Connect007
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.
Latest Column: Nolan’s Notes: The Registration Sweet Spot

John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Developing Your Team to Become Great Implementors

Tara Dunn, Averatek
When it comes to additive circuits, Tara really knows what she is talking about!
Latest Column: PCB Talk: Is DWM Just Another Buzzword?

Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: What Do Buyers Expect?

Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: The Perfect PCB Fab—A Vision for Five Years Ahead

Todd Kolmodin, Gardien Services, USA
Todd covers a range of electrical test and reliability issues.
Latest Column: Testing Todd: Why TDR?

Mark Thompson, Out of the Box Manufacturing
Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.
Latest Column: The Bare (Board) Truth: My Top Six Design Challenges

Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: Essential Engineering—The Intersection of Humans and Machines

Don Ball, Chemcut
Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.
Latest Column: The Chemical Connection: Don’t Just Blame the Etcher

Henry Crandall, IPC Student Board Member
All things health engineering, graduate school, and wearable health monitors.
Latest Column: The Doctor’s In: Beyond the Horizon—Exploring the Digital Future of Health

Chris Mitchell, IPC
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: An ‘Interesting’ Year in Washington and Brussels

Hannah Nelson & Paige Fiet, IPC Emerging Engineers
Two up and coming engineers discuss the bridge between electronics education and the electronics industry.
Latest Column: The New Chapter: Teach the Terminology

Team Elmatica, Elmatica
The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.
Latest Column: The PCB Norsemen: New Trends in the PCB Industry at productronica 2019

George Milad, Uyemura International Corporation
George's columns cover PCB plating, IPC specifications, and more
Latest Column: The Plating Forum: Reduction Assisted Immersion Gold for ENEPIG Surface Finish

Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Simplest Stackups Specified

Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Latest Column: The Right Approach: Leadership 101—Be a Heretic, Not a Sheep

Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: Simply Speaking

Michael Carano, IPC
A comprehensive look at plating, metallization processes and PWB fabrication techniques.
Latest Column: Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4