Latest News

Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2020
01/21/2020 | Rogers Corporation
AT&S Now in the Top League of Aircraft Suppliers
01/21/2020 | AT&S
Best Technical Papers at IPC APEX EXPO 2020 Selected
01/20/2020 | IPC
Ventec’s High-Speed/Low-Loss/High-Frequency Material Technology Takes Center Stage at U.S. Expos
01/20/2020 | Ventec International Group
Averatek Releases New High-Density Process Details at IPC APEX EXPO 2020
01/17/2020 | Averatek
UP Media Group Issues Call for Abstracts for PCB West 2020
01/16/2020 | UP Media Group
Hitachi Chemical DuPont MicroSystems, Ltd.: Regarding the Decision to Maintain Two Japanese Granted Patents on Polyimide Precursor Resin Composition
01/15/2020 | Business Wire
Firan Technology Group Corporation (“FTG”) Achieves AS9100D Certification at FTG Fredericksburg
01/15/2020 | Firan Technology Group Corporation
IPC Statement on U.S.-China Trade Deal
01/15/2020 | Chris Mitchell, IPC VP, Global Government Relations
Ucamco Releases New Gerber Fabrication Documentation Specification
01/15/2020 | Ucamco
SAAB Avionics Has Approved Elmatica's Jan Pedersen as Part 21 Subpart G Auditor for PCB Subcontractors
01/15/2020 | Elmatica
MoDeCH Launches SPICE Model E-commerce Website
01/14/2020 | MoDeCH
Amid Trade Row With Japan, South Korea Gains DuPont Investment to Make Chip Materials
01/14/2020 | Reuters
Rogers to Highlight High-speed Laminates and Next-Gen Thin Materials at DesignCon 2020
01/13/2020 | Rogers Corporation
CIMS VVR – The Revolutionary AOI Verification Concept
01/13/2020 | CIMS
NextFlex Awards Over $12.5 Million in Funding for Flexible Hybrid Electronics Innovations
01/09/2020 | Business Wire
GS Swiss PCB Invests in New Dynachem Vacuum and Press Lamination Lines Technology
01/09/2020 | Automatic Lamination Technologies (ALT)
TTM Technologies, Inc. Announces Upcoming Conference Participation
01/09/2020 | TTM Technologies, Inc.
SCHWEIZER Signs Distribution Agreement with Nagase for Japan
01/08/2020 | Schweizer Electronic AG
Ventec Builds Global Inventory of High-Speed/Low Loss/High Frequency Materials
01/08/2020 | Ventec International Group
Atotech to present at the NEPCON JAPAN 2020 in Tokyo
01/07/2020 | Atotech
Uyemura Appoints Technology Director
01/07/2020 | Uyemura
Mateo’s Smart Bathroom Mat Earns a CES Innovation Award
01/06/2020 | Business Wire
Technica USA to Distribute Meyer Burger’s Inkjet Soldermask Technology in North America
01/06/2020 | Technica USA
P2i's New Halogen-Free Barrier Range Will Help OEMs Meet Environmental Targets
01/03/2020 | PR Newswire
Meet Super PCB at IPC APEX EXPO 2020
01/02/2020 | Super PCB
Nano Dimension Appoints a New Chairman
12/26/2019 | Nano Dimension
Columnist Istvan Novak Nominated for Engineer of the Year
12/23/2019 | Andy Shaughnessy, Design007
Holiday Message from President of the THPCA
12/23/2019 | THPCA
North American PCB Industry Growth Continues Strong
12/23/2019 | IPC
Toray Creates Revolutionary PPS Film for 5G Circuit Boards
12/23/2019 | Toray Industries
Electronics Manufacturers Applaud U.S. House for Passing USMCA with Bipartisan Support
12/23/2019 | IPC
Mitsui Mining & Smelting Co. Ltd. to Sell Copper Foil Division to Nippon Denkai, Ltd.
12/20/2019 | Oak-Mitsui
Atotech Announces Confidential Submission of Draft Registration Statement for Proposed IPO
12/20/2019 | Atotech
U.S. Congress to Approve Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications
12/19/2019 | IPC
Keysight, AAC Technologies Extend Collaboration to Accelerate Market Introduction of High Performance 5G Antenna Solutions
12/19/2019 | Keysight Technologies, Inc.
€30 Million Investment: Groundbreaking Ceremony for Technology Upgrade at AT&S Korea
12/19/2019 | AT&S
Elmatica Further Expands Technology Department with New Hire
12/19/2019 | Elmatica
December Issue of PCB007 Magazine Available Now
12/18/2019 | I-Connect007 Editorial Team
TopLine to Exhibit at Internepcon Japan January 15-17 2020
12/17/2019 | TopLine
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