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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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ECWC 2014: The Drilling and Routing Session
Dr. Lianyu Fu from Shenzen Jinzan Precision Technology gave an interesting presentation on the optimisation of drilling parameters by investigation of drilling temperature and how the outcome led contributed to the development of an innovative single-edge tool geometry. He commented that although laser drilling played an increasingly significant role in PCB micro-via drilling, mechanical drilling was still a dominant technique for micro-hole formation, and ultra-small mechanical drilling was increasing in popularity.
Drill temperature had been demonstrated to be an effective process monitor for characterising and optimising drilling parameters and hole quality. Dr. Fu showed a video illustrating how a high-speed infra-red camera had been mounted on a fixture adjacent to the drill-head to make real-time temperature measurement as the drill bit was withdrawn from the stack. The output from the camera was stored and analysed for different tool geometries and drilling conditions.
Comparison of the performance of standard and single-edge micro-drills indicated that the single-edge tool generated less heat for a given set of drilling parameters. This design featured a unique cutting edge, with increased effective cutting length and improved chip-breaking performance, and an increased rake angle near the centre improved cutting performance. The result was more accurate positioning and a reduction in drilling force.
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EuroTech: Institute of Circuit Technology Northern Seminar 2016, Harrogate