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Setup Optimization
Every minute spent on setup is a minute not spent building product. As manufacturing shifts toward shorter runs and greater complexity, setup optimization is becoming a critical driver of throughput, uptime, and profitability.
Cleaning for Reliability
SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.
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A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
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Maggie Benson's Journey
Column from: Ronald C. Lasky
Ronald C. Lasky, Ph.D., PE is currently a senior technologist at Indium Corporation, an instructional professor of engineering at Dartmouth College, and a consultant with ITM. Prior to these assignments, he had over 30 years of experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments, and Cookson Electronics.
He has authored or edited six books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Lean Six Sigma Program. Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a New York State licensed professional engineer and a Lean Six Sigma Master Black Belt.