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As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
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Maggie Benson's Journey
Column from: Ronald C. Lasky
Ronald C. Lasky, Ph.D., PE is currently a senior technologist at Indium Corporation, an instructional professor of engineering at Dartmouth College, and a consultant with ITM. Prior to these assignments, he had over 30 years of experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments, and Cookson Electronics.
He has authored or edited six books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Lean Six Sigma Program. Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a New York State licensed professional engineer and a Lean Six Sigma Master Black Belt.