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Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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Maggie Benson's Journey
Column from: Ronald C. Lasky
Ronald C. Lasky, Ph.D., PE is currently a senior technologist at Indium Corporation, an instructional professor of engineering at Dartmouth College, and a consultant with ITM. Prior to these assignments, he had over 30 years of experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments, and Cookson Electronics.
He has authored or edited six books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Lean Six Sigma Program. Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a New York State licensed professional engineer and a Lean Six Sigma Master Black Belt.