-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Estimated reading time: 3 minutes
Contact Columnist Form
Update An Inside Look: UK Collaborative Research Project Dissemination Conference
The headquarters of the Surface Engineering Association in Birmingham, UK, was an appropriate venue for a one-day conference to disseminate the results of a number of UK and European collaborative research and development projects with direct relevance to the electronics manufacturing, surface engineering, and metal finishing industries.
The conference attracted an international audience from industry and academia, taking the opportunity to share and discuss the outcome of research on a range of new materials, manufacturing, and recycling approaches with a focus on both sustainability and the cyclic economy and offering the potential for more efficient production.
Dave Elliot, Surface Engineering Association chief executive, introduced and moderated the opening session. His first speaker was Dr. Andy Cobley from Coventry University who described how, as part of the multi-partner Susonence project, sonochemical processes had been applied to the tin-lead barrel plating of battery components, resulting in significant improvements in efficiency and productivity.
Low-frequency ultrasound had been demonstrated to improve electrolyte flow within the barrel, enabling the use of higher current densities without burning. Plating capacity had been increased and better uniformity of alloy composition had been observed. The applicability of sonochemistry to the electroplating of zinc-nickel alloy for the automotive industry was being investigated.
Professor Karl Ryder from University of Leicester introduced a new TSB consortium project labelled Macfest--manufacturing advanced coatings for future electronic systems--which had spun out of the recently-completed Aspis project, where some interesting observations had been made when using types of ionic liquid known as deep eutectic solvents as an alternative to aqueous chemistry in the deposition of immersion gold on electroless nickel. Macfest set out to explore the fundamental molecular properties and interactions of nickel and gold in deep eutectic solvents with the objective of producing ENIG finishes with improved coating quality, solderability and wire-bondability by a process compatible with existing PCB manufacturing techniques and with the additional benefits of low environmental impact and no toxic components.
Page 1 of 2
More Columns from The European Angle
CircuitData: A New Open Standard for PCB Fab Data ExchangeI Never Realised It Was So Complicated!
The European Angle: Institute of Circuit Technology 43rd Annual Symposium
Ventec International Group's Martin Cotton Celebrates 50 Years in PCB Design
Reporting on the Institute of Circuit Technology Spring Seminar
EuroTech: Raw Materials Supply Chain—Critical Challenges Facing the PCB Industry
EuroTech: ENIPIG—Next Generation of PCB Surface Finish
EuroTech: Institute of Circuit Technology Northern Seminar 2016, Harrogate