Estimated reading time: 15 minutes

SMART Group Seminar: Harsh Environments & Electronics

Post-assembly cleaning was essential and a conformal coating was required to prevent corrosion and oxidation, although presently only a limited choice of suitable coating materials was available.

The upper temperature limit for laminate-based PCB designs is considered to be 225ºC, and ceramic substrates offered a better option, with hermetic microelectronics approach considered the most robust solution. A critically-important consideration was to ensure that the materials and atmosphere enclosed in the package would not outgas in service, so they were vacuum-baked before sealing and sample sealed packages were subjected to residual gas analysis by mass spectrometry.

The stated objectives of SMART Group in promoting the advancement of the electronics manufacturing industry through the education, training, and notification of its members were emphatically achieved in this exceptional seminar. The audience had the benefit of the most up-to-date information from leading industry experts and the opportunity to engage in interactive discussion and to network with their peers. Special thanks are due to National Physical Laboratory for hosting the event and particularly to Dr. Chris Hunt for his efforts in organising and coordinating the programme.

• < Previous Page