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Measuring Multiple Lamination Reliability for Low-loss Materials

Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customers’ objectives and shows the deterioration of the resin’s physical properties as a result of multiple lamination cycles (up to 10X). This article describes how TUC evaluates the possible change in resin structure due to multi-thermal laminations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

According to a quick look at history.com, “Some historians speculate that April Fools’ Day dates back to 1582, when France switched from the Julian calendar to the Gregorian calendar. In the Julian Calendar, as in the Hindu calendar, the new year began with the spring equinox around April 1.” All well and good, but why April Fools’? “People who were slow to get the news or failed to recognize that the start of the new year had moved to January 1 and continued to celebrate it during the last week of March through April 1 became the butt of jokes and hoaxes and were called “April fools.”

Improved Thermal Interface Materials For Cooling High-Power Electronics

Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

EIPC Technical Snapshot: High-end PCB Market Requirements and Technology Trends

The European Institute for the PCB Community (EIPC) continues to provide an efficient platform for following and pursuing new developments. Its Technical Snapshot webinar has become established as a must-attend monthly event, and consistently delivers essential information of the highest calibre and relevance. The 16th in the series on March 23 focused on market requirements and technology trends at the high end of the PCB and semiconductor packaging industries, with two eminent speakers.

Developments in Low-Loss Substrates for High-Frequency Applications

The electronics industry as we know it today can trace its birth to the creation of the first integrated circuit in 1958, although conception occurred 10 years earlier with the invention of the transistor. That first IC contained a single transistor and four passive components. To say things have come a long way since then is a huge understatement.

Thank You to the I-Connect007 Team

During IPC APEX EXPO, the I-Connect007 team works very hard to bring you several great interviews that will keep you up to date on the latest industry activity. This year, we had Nolan Johnson, Andy Shaughnessy, Pete Starkey, and Happy Holden of I-Connect007 in front of the cameras. We also send out a very special thank you to our guest interviewers, who sat in the I-Connect007 show floor studio to conduct many interviews. The list includes Tara Dunn, Dick Crowe, Joe Fjelstad, Steve Williams, and Kelly Dack. Their contributions are greatly appreciated.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.

An Inside Look at an Indian PCB Manufacturer

As a student of the printed circuit board industry, I am always interested in learning more about companies all over the world. When I connected with Abhay Doshi, managing director of Fine-Line Circuits Ltd. in India, I welcomed the opportunity to learn more about him, his company, and the Indian PCB business as a whole—it was all that, and so much more. Here’s what I learned.

DFM 101: Edge Plating

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week seems jam-packed with holidays, both major and minor, doesn’t it? We started with “International Pi Day” on March 14. With all the obligatory pricing specials on most all things “pie” here in the U.S., suffice it to say, I’ve got a short stack bake-at-home pizza “pi” in my freezer, thanks to the one-day-only sales price of $3.14. Personally, I’m glad they didn’t make the promotional price = pizza diameter * Pi.

The Materials Connection

Recently, Eddie Mok, product innovation development AVP at WUS, talked with us at length about the state of the materials market from the perspective of a fabricator. In this excerpt from the conversation, Eddie details some example interactions between what materials, design, and manufacturing bring to the ultimate goal of meeting your design specifications and manufacturing costs. It is clear from this conversation that materials and technology are increasingly interconnected.

Calumet is Bullish on Additive and Semi-Additive

Calumet Electronics has been a domestic pioneer with additive and semi-additive electronics manufacturing processes. We recently asked Calumet’s Todd Brassard and Meredith LaBeau to discuss the state of this technology, which traditional processes that they might replace, and some of the challenges facing OEMs or PCB shops that are considering these options.

RF and Microwave: No Black Magic

I caught up with Ben Jordan after his class on RF and microwave at IPC APEX EXPO. Ben, an electrical engineer, explained how sitting through previous classes on this topic led to him developing his own class. “I wanted to bridge the gap,” he says, “with a class that makes the material approachable and teaches the intuitive nature of fields and waves and how they work in circuit boards.”

David Pogue: Is the Fear of Change Holding Us Back?

David Pogue, an American technology and science writer and TV presenter, sat down with the I-Connect007 Editorial Team after his keynote presentation at IPC APEX EXPO to talk about today’s technology, the breakthroughs that have shaped our current landscape, and whether fear of change and innovation is what’s keeping us from the next technological revolution. What do you think?

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s Friday, and I’ve spent the last few days breaking in my new laptop. It’s a Mac, and it’s been a while since I used one of these. It occurred to me that the last time I used a Mac, there was no email and no internet. I was editor of my college newspaper. I had just voted for Clinton, because that’s what you did in your 20s. We had Apple Classic II monitors with screens the size of a postcard, and we were on the cutting edge of desktop publishing. Students submitted articles on 3.5” loppy disks or on notebook paper, sometimes written in pencil. That’s where I learned to edit, and to do it quickly. We won awards every year. Good times.

Institute of Circuit Technology: A Novel Approach to Recycling PCBs

A two-year project funded by an Innovate UK SMART Grant aims to reduce the impact of e-waste using naturally derived, biodegradable and nontoxic products. Those attending the webinar for the Institute of Circuit Technology’s annual meeting on March 2 learned more about the project, as well as statutory paperwork obligations of the UK REACH regulations. Following the formal business, ICT Chair Emma Hudson introduced and moderated this technical webinar.

Happy Holden Reflects on Successful IPC APEX EXPO 2022

The attendance at this year’s IPC APEX EXPO seemed higher than I expected, so thank you all for making the necessary arrangements to attend. However, we sorely missed many of our foreign contributors and friends. One of my cherished reunions was with Pete Starkey, who fought through the red tape of government restrictions to make his way from England for the show. Both of us were able to help conduct interviews with many of the industry’s business and technical leaders. For that, I am grateful.

IPC APEX EXPO From a College Student’s Perspective

My name is Hannah Nelson, and I am currently a junior electrical engineering major at Valparaiso University. I was given the honor and privilege to attend the IPC APEX EXPO as the new student director on the IPC Board of Directors. The student director position is used as a voice on the board for all IPC student chapters. It is a way to bridge the barrier between the educational system and the electronics industry and bring students toward the Factory of the Future. By attending APEX EXPO, I was given the opportunity to expand my knowledge regarding the needs of students who are heading into the industry.

IPC Student Director: Three Things IPC APEX EXPO Taught Me

IPC APEX EXPO 2022 was my first in-person APEX EXPO event, and it surely did not disappoint. The show this year was packed with high quality technical courses, engaging professional development courses and, of course, an admirable show floor exhibition. This year APEX EXPO really resonated with me, and I would like to leave you with three insights I learned while attending.

Conversations With Two IPC President’s Award Winners

We interviewed two of this year’s IPC President’s Awards, Joe Kane of BAE Systems and Zhiman (Susann) Chen of Zhuzhou CRRC Times Electric Co., Ltd. The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronics interconnect industry. The award is a personal honor to recognize the winners’ selfless dedication to the electronics industry in terms of their time, expertise, and leadership.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In the news this week we found a synchrony of topics. Much of the world is aware of the speaking points from U.S. President Joe Biden’s State of the Union address this past Tuesday. In that speech, President Biden talked prominently about U.S. legislation in process to bring more technology manufacturing back to the states. In fact, Intel CEO Pat Gelsinger was not only an invited guest, but was referred to directly in the speech as a positive example. I can only assume that President Biden meant that moment to be a motivator for other CEOs in the industry.

Bob Neves: IPC Continues Its Global Reach

During IPC APEX EXPO, Nolan Johnson visited with Bob Neves of Microtek Laboratories China and the new board chair of the IPC Board of Directors. Nolan asks Bob about IPC’s views on the disruption in supply chain, about restoring PCB fabrication in the United States, and how the IPC is looking to resolve supply chain issues from a global perspective.

IPC EMS Leadership Summit: Peer Solutions to Supply Chain and Labor Development

EMS leaders gathered for the EMS Leadership Summit on Monday, January 24 at IPC APEX EXPO. Expert and peer presentations on priorities ranging from the economy to the supply chain, cybersecurity, and software were interspersed with peer-to-peer discussions on several key topics.

Joe O’Neil Joins Illustrious Group of IPC Hall of Famers

The IPC Raymond E. Pritchard Hall of Fame Award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and in the advancement of the industry, including the creation of a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of the IPC on a long-term basis. This is the highest level of recognition that IPC can give to an individual and is based on exceptional merit over a long-term basis (the operative word being long term).

Where Have All the Board Shops Gone?

When I look at the landscape of U.S.-based PCB fabricators, the title of this article reminds me of a 1960s protest song. If you don’t remember the song or that era, you have some interesting research to do. As well, a Hank Williams Jr. song comes to mind, “All my rowdy friends have settled…” Seriously, I am pleased to see many of my old friends taking advantage of the present opportunities.
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