Latest News

Atotech Announces Confidential Submission of Draft Registration Statement for Proposed IPO
12/20/2019 | Atotech
U.S. Congress to Approve Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications
12/19/2019 | IPC
Keysight, AAC Technologies Extend Collaboration to Accelerate Market Introduction of High Performance 5G Antenna Solutions
12/19/2019 | Keysight Technologies, Inc.
€30 Million Investment: Groundbreaking Ceremony for Technology Upgrade at AT&S Korea
12/19/2019 | AT&S
Elmatica Further Expands Technology Department with New Hire
12/19/2019 | Elmatica
December Issue of PCB007 Magazine Available Now
12/18/2019 | I-Connect007 Editorial Team
TopLine to Exhibit at Internepcon Japan January 15-17 2020
12/17/2019 | TopLine
PCC Clears Circuit-Maker’s Buyout of Shares in Hitachi PH
12/16/2019 | Philippine News Agency
Samsung Electro-Mechanics Shuts Down HDI Operations in China
12/16/2019 | Samsung
IPC Welcomes U.S. – China Phase One Deal
12/16/2019 | IPC
Ventec Invests in Key Equipment to Support Expansion of PTFE Laminates Manufacturing
12/16/2019 | Ventec International Group
Samsung Electro-Mechanics to Shut Down HDI Unit in China
12/13/2019 | SamMobile
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
12/18/2019 | I-Connect007
Eurotech Expands with the Acquisition of Lyncolec
12/12/2019 | Eurotech
Electronics Manufacturers Applaud Bipartisan USMCA Deal
12/11/2019 | IPC
Register Now for the EIPC Winter Conference Feb. 13-14
12/30/2019 | EIPC
American Standard Now Offers PCBs Up to 0.5 Inches in Thickness
12/11/2019 | American Standard Circuits
IPC: Electronics Manufacturers Report Slowing Growth, Cautious Optimism
12/10/2019 | IPC
TTM Technologies, Inc. Announces Opening of Engineering Center in Binghamton, NY
12/10/2019 | GlobeNewswire
High-Power UV-LED Systems for 3D Printing, Maskless Photolithography
12/09/2019 | Novus Light Technologies Today
Day 3 Slide Show: International Electronics Circuit Exhibition (Shenzhen)
12/06/2019 | I-Connect007 Editorial Team
Looking Back on IPC’s First Annual Electronics Materials Forum
12/06/2019 | Brook Sandy-Smith, IPC
iNEMI Call for Participation Webinar Dec. 12
12/06/2019 | iNEMI
Day 2 Slide Show: International Electronics Circuit Exhibition in Shenzhen
12/05/2019 | I-Connect007 Editorial Team
DVCon U.S. 2020 Advance Program Available & Early Registration Open
12/05/2019 | GlobeNewswire
Nano Dimension Appoints New President and CEO
12/05/2019 | Nano Dimension Ltd.
2019 International Electronics Circuit Exhibition Opens in Shenzhen
12/04/2019 | HKPCA
RBP Announces the Release of MetalTreat Chelate Eliminator-8
12/04/2019 | RBP Chemical Technology
TTM Technologies, Inc. to Exhibit at the International Electronics Circuit Exhibition in Shenzhen, China
12/03/2019 | GlobeNewswire
IPC Education Foundation Announces Change in Leadership
12/03/2019 | IPC
EMS Execs to Take Their Companies to Next Level at IPC APEX EXPO 2020
12/02/2019 | IPC
MacDermid Alpha Develops New Soldering Flux for Thick PCBs
12/02/2019 | MacDermid Alpha Assembly Division
Gardien Rolls out 4-Wire Kelvin Upgrade Kit
11/29/2019 | Gardien Group
IPC Designers Council Cascade Chapter Meeting Dec. 4
11/27/2019 | Tim Mullin, Designers Council Cascade Chapter President
International Electronics Circuit Exhibition Shenzhen Presents Technical Conference
11/27/2019 | HKPCA
North American PCB Industry Growth Continues and Outlook is Positive
11/26/2019 | IPC
Ventec Appoints Anthony Jackson as General Manager UK
11/26/2019 | Ventec International Group
Element Solutions Inc Launches Innovation Prize to Reward Technological Curiosity in Relevant Materials Science
11/25/2019 | Element Solutions Inc.
Heraeus, SigmaSense, and Xymox Showcase PEDOT, Flexible Touch Sensor
11/25/2019 | SigmaSense LLC
DesignCon Expands Into Artificial Intelligence, Automotive, 5G, IoT, and More For 2020 Edition
11/22/2019 | GlobeNewswire
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