Estimated reading time: 9 minutes

An Inside Look: 3D AOI of Electronic Assemblies Seminar

In his alternative capacity as Technology Editor of SMT Today Keith Bryant returned to the rostrum with a wrap-up presentation designed to provoke controversy in the final panel discussion, entitled “Is (was) 2D really so bad?” After reviewing scanning methods and extra or floating component detection, he explained the technology of the telecentric lens and the relative benefits of coaxial lighting and multi-light technology, somehow managing to include a photograph of Bob Willis clad in a Hawaiian shirt and carrying an inflatable parrot! He concluded that the “real” answer was for all 3D systems to contain some 2D technology. Although the third dimension was just Z, a measurement, it represented “a whole new dimension.” He commented that component and board warpage become bigger issues each year. Because an increasing number of components came in bottom-termination packages, AOI was of limited value in determining solder joint integrity and in-line X-ray was not fast enough for many applications. He suggested a link between AOI and X-ray such that that the X-ray went to any questionable areas and the operator only needed to inspect suspect components, which would save a lot of time and improve yields.

AOI systems have undergone rapid development in recent years, and have evolved from very basic 2D image recognition machines to sophisticated 3D systems that can reliably detect the full range of assembly defects at production-line speeds. The ability to look for trouble has truly taken on a new dimension, and this well-organised SMART Group seminar delivered a wealth of up-to-the-minute information and provided an opportunity for existing and would-be 3D AOI users to understand and discuss the relative merits of the different approaches of major players in the industry.

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