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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Column from: Kelly Dack
Kelly Dack, CIT, CID+, is a PCB designer, writer and educator with a demonstrated history of success in the electronics design & manufacturing industries. Kelly understands that PCB design involves a lot more than getting electrons to flow through a circuit on a PCB. He has dedicated his career to demonstrating that PCB design must include knowledge about how to lay out a PCB to flow efficiently through the manufacturing process lines for fabrication and assembly. Kelly’s holistic experience in the printed circuit design and manufacturing industries is underlined by proven PCB design capability serving a wide array of aerospace, medical, telecommunications, and gaming industries. Currently, Kelly provides DFx-centered PCB design layout and manufacturing engineering services for a dynamic EMS provider in the Pacific Northwest. Additionally, he is employed by EPTAC Corporation as a Certified PCB Design (CID) instructor. Kelly has a passion for on-cam interviewing and product promotion and appears as a frequent guest editor on I-Connect’s Realtime With, video content.