Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
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ITEQ’s Tarun Amla Discusses 5G Inflection Points
ITEQ Corporation Executive VP and CTO Tarun Amla discusses effects of 5G on materials and shares general observations on the 5G rollout at DesignCon. He also talks about the challenges for their customers, and how they help them address their issues.
Staying Current on Flex Manufacturing is Smart Business
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.
EIPC Winter Conference, Day 2
After the papers from the first day of the EIPC Winter Conference in Milan on February 14–15, the delegates were hosted at a reception and plant tour of Elga Europe at their nearby production facility. Here's a recap of the events and highlights of the Day 2 of the conference.
Automation on Full Display at Recent China Exhibitions
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.
RTW IPC APEX EXPO 2019: Miraco Discusses Flexible Circuit Products and Offerings
Jason Michaud is the vice president of sales and marketing at Miraco Inc. In this interview, Michaud discusses with Joe Fjelstad the history of the company, and their flexible circuit products and offerings. He also talks about how they are helping customers improve their product designs.
Nano Dimension Offers Update on Dragonfly 3D Printer a Year After Launch
The Nano Dimension Dragonfly 3D printer arrived in much fanfare a little over a year ago. The company has been selling them to customers around the world, many of whom are using them to print antennas, sensors, and PCBs. At AltiumLive in Munich, I asked Product Manager Robert Even to discuss what they’ve learned in the year since the Dragonfly debuted, and some potential uses for 3D printing technology.
Meyer Burger on Inkjet Technology and Digital Printing Benefits
Don Veri, sales and business development manager for Meyer Berger, discusses some of the challenges fabricators face in adopting inkjet technology, the benefits they can expect once it’s deployed in their facility, and the advantages of digital printing in solving problems on the shop floor.
RTW IPC APEX EXPO 2019: Arlon Discusses Investments and Important Role of a Niche Supplier
Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.
Dan Gamota Discusses Flex and Alternative Substrates
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
Flex/MSTC Joint Conference: A Collaborative Week in Monterey
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.
Institute of Circuit Technology Evening Seminar
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.
Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program
At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.
Isola Executive Vice Chairman and Acting CEO Travis Kelly on the Upcoming Year
Isola Executive Vice Chairman and Acting CEO Travis Kelly discusses the recent milestones for the company, including the leadership transition. Travis also outlines his agenda for the upcoming year and gives an update on Isola’s new facility in Chandler, Arizona.
RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services
Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.
RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
Thinking and Designing in Three Dimensions
This article aims to encourage interconnect designers who design for flex or rigid-flex circuits to use the modern CAD tools at their disposal for getting flex done right the first time. While modeling PCBs in 3D is not new, and all the major PCB EDA vendors offer some form of 3D modeling and integration, it is still a rare circumstance that flexible circuit designers use 3D CAD modeling.
Tara Dunn Shares Strategies for Today’s PCB Business
At the recent AltiumLive event, Barry Matties met with PCB sales expert Tara Dunn of Omni PCB to discuss selling strategies for selling PCBs in the North American market. The conversation also covers strategies for staying competitive through a generational shift in the ownership of PCB shops, and the importance of supply chain communication and building relationships.
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager
Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.
Words of Advice: Flex Design and Manufacturing Training
In a recent survey, we asked the following question: Where do your technologists acquire training or expertise regarding flexible circuits? Here are just a few of the answers, edited slightly for clarity.
RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer
Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.
IPC APEX EXPO 2019 Show Week Time-lapse Video
From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management
Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.
Words of Advice: Flex Design Problems
In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are just a few of the answers, edited slightly for clarity. How many of you would agree that "educating the customer" is your biggest challenge?
Laser Focus on Flex and Rigid-flex
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.
CES 2019: More Show Floor Favorites
In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.
Atotech at HKPCA on Announcements and Advancements
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.
ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think
At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.
Robert Art on the Importance of Thermal Management
Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.
Top 10 Most-Viewed FLEX007 Articles in 2018
Here’s a list of the top 10 most viewed FLEX007 articles in the past year.
Top 10 Most-Read PCB007 Interviews of 2018
Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.
The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).
Successful Flex Circuit Design and Processing Guidelines
With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.
Technology Ambassador Alun Morgan
Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.
Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.
Meet All Flex’s New President and CEO Matt Keithly
All Flex Flexible Circuits and Heaters recently appointed Matt Keithly as their new president and CEO. In this exclusive interview, Keithly discusses his background, the direction of the company, and topics related to flexible circuits and other areas of All Flex’s business.
150+ Years of Experience: Reflections with Three Industry Icons
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.
Increasing Productivity for Flex Fabricators
Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.
IPC Workforce Pledge Draws White House Praise, Points the Way to Jobs of the Future
President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.
Substrates for Advanced PCB Technologies: What Will the Future Hold?
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Powering the Flexible World
From 2019 we will come to a world with flexible electronics and batteries to power these devices have attracted tremendous attention. These devices may require batteries with special mechanical properties or form factors.
IPC Signs White House Pledge to the American Worker
IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.
Flex Talk: Additive Electronics—PCB Scale to IC Scale
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.
RTW SMTAI: John Mitchell Updates on IPC's Education Efforts
Dr. John Mitchell, president and CEO of IPC, sits down with I-Connect007 Managing Editor Nolan Johnson to discuss IPC's recent work in education and workforce engagement, as well as the latest developments in their certification program.
What's FLITE About? An Old Man's Observations
FLITE—Female Leaders in Tech, Everywhere—aims to raise the visibility of females in technology, manufacturing, and engineering by celebrating their achievements and learning from their experiences. I-Connect007 Technical Editor Pete Starkey sit in on FLITE's networking event at the recent What's New in Electronics (WNIE) Live show to find out more about this enterprise, which turned out to be an inspirational eye-opener.
SLP: The Next Level of Technology
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?
Institute of Circuit Technology Hayling Island Seminar
After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.
Building a Better Board: It Always Comes Back to Communication
For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.
Reliability Takes on a New Urgency
Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.
Atotech on Challenges and Opportunities in PCB Manufacturing
Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.
More Than a Word: Solder Mask
Do you spend time, as I do, musing on the language of PCBs? We have developed our own lexicon to convey as much by picture, as by word, what exactly we mean.
Flex Circuit Assembly: Challenges and Strategies for Success
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.
I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.
Reflow Perspectives to Flex Circuit Assemblies
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Flex Time: Why is Rigid-Flex So Expensive?
One question that I hear fairly often, particularly after an initial quotation, is “Why is rigid-flex so expensive?” In this article, I’ll share with designers the cost drivers in rigid-flex relative to standard rigid boards and flex circuits with stiffeners. A typical rigid-flex PWB will cost about seven times the cost of the same design on a hard board, and two to three times an equivalent flex circuit with stiffeners.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.
RMAs: Negative Experience or Valuable Opportunity?
Non-conforming material that is sent back by the customer can easily be interpreted as a negative experience. However, if it is perceived as an opportunity to learn and support the customer it becomes a much more pleasant and satisfying endeavor.
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