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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Latest Articles
IPC APEX EXPO 2021 Keynote: Travis Hessman on ‘The Great Digital Transformation’

Bonding Hybrid Multilayer Constructions at Rogers Corporation

Jan Pedersen: Dieter Bergman IPC Fellowship Award Recipient

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IPC APEX EXPO Keynote: John Mitchell on the State of the Industry

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Focus on Smart Processes, Not Just Smart Factories

EIPC Technical Snapshot: Cleanliness

2020: A Year of Learning, Innovation for Taiyo America

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Finding Process Improvement Opportunities in Training

Predicting a ‘Roaring Twenties’ Innovation Boom

Quality and Continuous Improvement

Functional Inkjet Printing in PCB Manufacture

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The Benefits of Statistical Process Control

Benchmarking With Your Suppliers: What to Know About Solder Mask

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USPAE Launches $42M DoD Consortium
