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The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Latest News
PCB Technologies Acquires Galil Microwaves & Microelectronics Ltd.
11/23/2022 | PCB Technologies Ltd.
TTM Technologies Awards Matrix Electronics '2022 Global Supplier Award for Excellence'
11/18/2022 | Matrix Electronics
Global Flexible PCB Market Report 2022: Increasing Demand from Automotive Industry Driving Growth
11/15/2022 | Globe Newswire
Cicor Strengthens Presence in Germany; Acquires Phoenix Mecano Digital Elektronik and Phoenix Mecano Digital Tunisie
11/15/2022 | Cicor Technologies Ltd.
American Standard Circuits Earns Its IATF 16949 Automotive Re-Certification
11/14/2022 | American Standard Circuits
High Density Packaging User Group Announces Mitsui Mining & Smelting Membership
11/11/2022 | HDP User Group
Purdue Defense Research Focuses on Expanding Knowledge of Nontoxic Alternatives for Circuit Boards
11/10/2022 | Purdue University
Industry Veteran Robert Duke Joins American Standard Circuits to Lead New Global Sourcing Division
11/07/2022 | American Standard Circuits
Rogers Issues Statement Regarding DuPont’s Notice of Termination of Merger Agreement
11/02/2022 | Rogers Corporation
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