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An Update on the Omnibus on Sustainability Reporting

The European Commission (EC) released its Omnibus on Sustainability Reporting Proposal on Feb. 26,  2025, as part of its agenda to simplify EU sustainability legislation and reduce administrative burdens for companies while safeguarding the objectives of the EU Green Deal, including content and a timeline proposal. The initial “content” proposal amended key content-related provisions of the Corporate Sustainability Reporting Directive (CSRD), the Corporate Sustainability Due Diligence Directive (CSDDD), and the EU Taxonomy (EUT) Regulation.

North American Electronics: Growth & Challenges with Joe Schneinder

Nolan Johnson interviews Joe Schneider of the Global Electronics Association about North American electronics industry trends. Schneider discusses the surge in US data center demand, the association's work on AI standards, and strategic focus on aerospace and defense. The conversation addresses workforce development and capacity challenges, highlighting Global Electronics Assiciation's commitment to supporting member growth and knowledge acquisition in 2026.

SMTA Dallas Expo & Tech Forum: A National-level Local Event

Gary Tanel is the long-time chapter president of SMTA Dallas. He has been active in the industry for many years, retiring from Texas Instruments and Raytheon and then starting his own contract manufacturing company. He has been on the board of directors of SMTA and has held every office at the national and local level. He has received both the Founder’s and the Excellence in Leadership Awards from SMTA. Gary has been the SMTA Dallas Expo chair for many years, including for the 23rd annual show.

What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing

The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.

Educational Highlights From the APEX EXPO 2026 Show Floor

APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.

Viscom AI Inspection Technology Explained

Jesper Lykke discusses how AI revolutionizes automated inspection and programming, significantly enhancing speed and accuracy. Viscom's V-Vision and ProVision software, featuring advanced AI integration.solutions for industry challenges like miniaturization and large circuit board inspection, serve the booming demand for data center and backplane boards.

Take the Mic: Advanced Encapsulation Process with LPMS USA

Explore LPMS USA's innovative low pressure molding process for LED circuits, demonstrated by Brian Betti at APEX EXPO 2026. Witness the KAPPA 1100H machine utilizing a low-viscosity polyamide resin to safely encapsulate sensitive components. This professional demonstration highlights advanced manufacturing techniques and the versatility of low-pressure molding for electronic applications.

Take the Mic: Customer-Driven Innovation in Materials with Koki

Koki's innovative approach to customer-centric product development is highlighted in this show floor interview with Shantanu Joshi at APEX EXPO 2026. Learn how Koki collaborates with clients to create tailored silver and coating solutions, addressing challenges like voiding and enhancing reliability. The company's micro-alloying techniques and free analytical services designed to optimize performance and manage costs.

Akrometrix Discusses AI Chip Board Demands

Paul Handler of Akrometrix discusses the evolving demands in PCB fabrication, particularly the surge in large-format, room-temperature boards for AI chips. He highlights the critical need for inline, real-time testing of heavy, high-value circuit boards and Akrometrix's strategic shift towards integrated Industry 4.0 solutions. Handler also highlights the engineering challenges and the company's positive outlook for industry growth.

Remtec: Advanced Ceramic PCB Solutions

Explore Remtec's advanced PCTF® technology and its critical role in power electronics and heat dissipation. Dan Beaulieu and Brian Buyea chat about Remtec's US-based manufacturing capabilities, innovative assembly processes, and the superior thermal conductivity of their ceramic substrates. Remtec is shaping the future of high-performance components for defense, aerospace, and automotive industries.

Mexico's Electronics Growth and Future With Lorena Villanueva

Lorena Villanueva, director of the Global Electronics Association Mexico, discusses the burgeoning role of the electronics industry in Mexico, highlighting significant membership growth and the "three helix" approach to sector development. The conversation with Marcy Laront also touches upon workforce training, global curriculum adoption, and initiatives to encourage female participation in electronics.

Balanced Approach Needed to Regulate PFAS in Electronics

The very broad per- and polyfluoroalkyl substances (PFAS) group has widespread use in both consumer and highly specialized applications, including, perhaps surprisingly, green technologies. Among these, the fluoropolymers subgroup plays a complex and critical role in electronics. To date, there are hardly any technically comparable alternatives. The electronics industry is facing a major regulatory and business challenge as inconsistent policies on potential PFAS restrictions in electronics are emerging across regions worldwide, and, in the U.S., in different states.

The Electronics Foundation: Empowering Students, Strengthening Industry

The Electronics Foundation may be one of the industry’s best-kept secrets, but its impact is anything but small. In this interview, Charlene Gunter and Gentry Manning discuss how the Foundation is building a pipeline of future electronics professionals through student chapters, scholarships, hands-on STEM programs, and global outreach. From high schools to universities, and from soldering kits to career exploration, they share how meaningful industry engagement is opening doors for students while helping manufacturers address workforce needs.

SMT Renting: Redefining Equipment Investment

SMT Renting, based in Copenhagen, is challenging the traditional machine-ownership model with a flexible, service-based approach. Business Manager Christian Thers discusses how rental options, “stop and swap” flexibility, and a new pay-per-placement model help electronics manufacturers reduce risk and adapt quickly in an unpredictable market.

Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics

I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

EMS Leaders Express Optimism Through Growth and Expansion

It was a strong opening day for APEX EXPO 2026, with a keynote by Zach Kass on the AI revolution, followed by a ribbon-cutting to officially open the event, which featured Irish dancers on this St. Patrick’s Day, and opening remarks by Global Electronics Association CEO John Mitchell. But I’d like to tell you about the EMS Leadership Summit on Monday, where approximately 60 EMS industry leaders from 40 companies participated. There were several speakers, a panel discussion, and discussion groups.

A New Strategic Partnership in Europe

Marcy LaRont connects with OMR Italia General Manager Sara Menclossi and Connexion Technologies CEO Craig Wright to discuss the new strategic partnership between OMR Italia and Connexion Technologies: a merger between advanced PCB manufacturing and engineering-led PCB sourcing that “connects two very complementary strengths.” What does that mean for the two companies, their customers, and the electronics industry in Europe?

APEX EXPO Opens Today With Ribbon Cutting and Sold-Out Show Floor

APEX EXPO officially opens today with a ribbon-cutting ceremony welcoming attendees onto the sold-out show floor in Anaheim, California. Standards committee meetings and professional development courses have been underway since the weekend, but Tuesday marks the official opening of the exhibition as more than 400 exhibitors prepare to showcase their latest equipment, materials, and technologies across 140,000 square feet of exhibit space.

From PEDC to APEX: Banyan.eco’s Disruptive AI for EMS and OEM Companies

The electronics industry’s struggle with supply chain resilience and increasing regulatory complexity has created a costly compliance challenge for OEMs and EMS providers alike. At the same time, advances in artificial intelligence are opening new possibilities for automating some of the industry’s most data-intensive tasks. At the Pan-European Design Conference (PEDC), Banyan.eco cofounder Francis D’Souza introduced a new approach that combines AI-driven data acquisition with a deterministic verification layer to eliminate compliance risk from AI hallucination and dramatically improve productivity.

From Classroom to Boardroom: One Year Yields a World of Perspective

Few college seniors can say their first plane ride took them straight into a global electronics boardroom. However, Emily Daley, a Michigan Technological University electrical engineering student, spent her senior year as the Student Board Member to the Global Electronics Association Board of Directors. She brought a fresh, student-centered perspective to the industry as she attended APEX EXPO, as well as board meetings in Taiwan and Lake Tahoe.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Cue up “The Final Countdown, the monster ’80s hit song by Swedish band Europe, because it’s almost APEX EXPO week. Side note: When it comes to rock anthems, I’m more of an “Eye of the Tiger” man, myself. Some folks are already arriving in Anaheim, as standards development committee work starts as early as tomorrow. The show continues through Thursday, March 19.

I-Connect007 to Launch Weekly Show & Tell Newsletter Series Featuring APEX EXPO Highlights

Building on our tradition of delivering comprehensive coverage of APEX EXPO 2026, I-Connect007 will present a five-episode Show & Tell Newsletter series, arriving in subscribers’ inboxes each Friday, March 27 to April 24. The special series will highlight key moments from the Global Electronics Association’s annual trade show, offering readers an inside look at the people, companies, and ideas shaping the electronics manufacturing industry.

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.

SMTA WLPS 2026 Review: Shifting Microelectronic Package Development

The Surface Mount Technology Association (SMTA) hosts a number of timely events each year to focus on key technologies. The most recent, the 2026 Wafer-Level Packaging Symposium, held in San Francisco this February, brought together prominent technologists and manufacturers involved in microelectronic package development and related infrastructure.

The Power of Apprenticeship: Connecting Talent, Training, and Opportunity

The lack of a skilled workforce looms large over the electronics manufacturing industry, but the Global Electronics Association is building a powerful solution through an apprenticeship program that has evolved into a nationally recognized, well-funded workforce engine. Cory Blaylock and Vicki Hawkins are cutting through red tape with the U.S. Department of Labor (DOL) to access millions of dollars in funding, and their collaboration with industry companies, creative problem solving, and commitment to success is helping address this great challenge and shape the next-gen electronics workforce.

Learning Lounge Returns, Better than Ever

When we introduced the Learning Lounge at APEX EXPO 2025, it was an experiment born from necessity and creativity. This year, it returns as a proven destination for anyone seeking practical knowledge, industry insights, and expert-led discussions right on the show floor. The Learning Lounge concept emerged in October 2024 when I approached Alicia Balonek, senior director of events, about creating a dedicated space for sessions focused on education, training, workforce development, and technical challenges.

Safety First: ADAS, Connectivity, and Interfaces on the Road to Reliability

EVs function as intelligent, software-centric platforms where safety, connectivity, and user experiences are deeply intertwined. Advanced driver assistance systems (ADAS), vehicle connectivity architectures, and digital driver interfaces now play a central role in both vehicle operation and customer perception. EVs provide synergies for ADAS and connectivity because their strong electrical base provides a natural framework for integrating the advanced sensors, telematics, and high-reliability control units required for ADAS and connected systems.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’m highlighting a book, a podcast, a magazine, winners of the APEX EXPO Technical Conference, and a narrative-style column. Not only do these published pieces vary in style, but they also examine the electronics industry from a variety of perspectives. From test to materials, trade show storytelling, and thought leadership, I-Connect007 has the industry covered.

Professional Development Courses for Every Electronics Manufacturing Sector

Professional Development Courses at APEX EXPO are designed to give electronics professionals focused, instructor-led learning that connects directly to today’s manufacturing realities. The courses are offered Sunday, Monday, and Thursday, and allow attendees to build new skills while still taking part in the broader APEX EXPO experience.

India and Southeast Asia: Strengthening Global Electronics Manufacturing Through Skills, Standards, and Collaboration

As the global electronics industry convenes at APEX EXPO 2026, the India and Southeast Asia region stands out as one of the most active and strategically important contributors to the global electronics ecosystem. Rapid manufacturing expansion, sustained workforce development, and growing alignment with global standards are reshaping how the region engages with international supply chains. For the Global Electronics Association, APEX EXPO provides an important platform to reflect on recent progress across India and Southeast Asia and to advance collaboration with global industry stakeholders.

Real Time with... APEX EXPO 2026: Technology Advancements and Partnership Growth with Technica

Jason Perry, president of Technica, U.S.A., discusses the company's significant advancements. This interview covers Technica's integration into EMC Group, growth in their PCB and PCBA business, and new national distributor partnerships. Jason also highlights upcoming technical demo days focusing on emerging technologies and AI.

Real Time with... APEX EXPO 2026: IPC Certification Trends With Blackfox

Jamie Noland of Blackfox Training discusses crucial trends in IPC certification. Noland highlights the demand for updated standards like IPC J-Standard 001 and WHMA A-620, especially within the aerospace sector. The conversation also addresses the importance of these certifications for demonstrating employee expertise and Blackfox's role in providing focused, effective training solutions.

A Critical Moment for Europe’s Electronics Ecosystem

As Europe reexamines its industrial strategy amid geopolitical shifts, how does electronics become a critical priority? In this interview, Alison James, senior director Europe, government relations, at the Global Electronics Association, explains how industry advocacy is influencing the review of the European Chips Act, and why the conversation must extend beyond semiconductors to include PCBs, EMS, and complete systems. With 27 member states to align, can policy move fast enough to secure Europe’s electronics future?

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

Mexico at APEX EXPO 2026: Building the Future Together, One State at a Time

As the electronics industry gets ready for APEX EXPO 2026 in Anaheim, Mexico returns with something very important to say: we are building the future of electronics together—across regions, industries, and borders. This will be the second year in a row that Mexico participates with an organized Mexico Pavilion, coordinated by Global Electronics Association Mexico. What started in 2025 as a historic first step is now becoming a sustained national effort, bringing Mexican states, companies, and institutions to the global stage with one shared vision.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!

After IEEPA: What Electronics Companies Should Know About Tariff Refund Strategies and Section 122

The U.S. Supreme Court’s recent decision striking down tariffs imposed under the International Emergency Economic Powers Act (IEEPA) opens the door to potential refunds for electronics companies and signals a rapid pivot to alternative trade statutes, setting the stage for a volatile 150-day period that could significantly affect global electronics supply chains. Trade and electronics industry leaders gathered for a webinar hosted by the Global Electronics Association on Feb. 24 to learn more about the landmark U.S. Supreme Court decision.

Technology Pavilion Debuts at APEX EXPO 2026

Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.

Growing an Engineer: Meet Emerging Engineer Julian Vega

Julian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.

Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly

Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.

Big Ideas Take the Stage: APEX EXPO 2026 Keynotes

Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.

Real Time with... APEX EXPO 2026: KYZEN’s Jayson Moy on Turning Cleaning Innovation Into Customer Gains

Jayson Moy, KYZEN's director of global product lines, discusses the company's ongoing R&D, how that work is appearing in conference papers and presentations, and how constant cleaning product development makes for cost savings and efficiencies for customers.

Electronics Trade in a Persistent Tariff Environment

Tariffs affecting the electronics sector were largely still in place at the end of 2025, even as the pace of new announcements slowed, and several electronics-relevant investigations and legal questions pushed key decisions into 2026. For companies operating global electronics supply chains, tariffs are no longer a short-term disruption; they are part of the operating environment. The costs facing electronics manufacturers are no longer limited to the tariff rates we see in headlines.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Frankly, there were so many worthy news items this week, it quite a bit of whittling to get it down to my five must-reads. For example, this week we showcased Schweitzer Engineering Labs’ new manufacturing facility in Moscow, Idaho. Marcy LaRont launched an On the Line With… podcast on materials, and the February issue of I-Connect007 Magazine features the annual APEX EXPO preview.

New IPC Standards Released

Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.         

From Aspiration to Acceleration: How IEMI Reflects India’s Electronics Growth

In 2022, the Global Electronics Association’s team in India launched Integrated Electronics Manufacturing & Interconnections (IEMI) as a humble yet aspirational vision for India to become a vital community connector between global supply chains and regional electronics manufacturing ecosystems. Fast forward to January 2026, and a lot has certainly happened in the macro-sense within four lightning quick years. Against this immense backdrop of progress, the fourth edition of IEMI, held in Bangalore on Jan. 29–30, was attended by 1,600 delegates, including 100 from 15 countries outside India representing Asia, Europe, Africa, North America, and Australia. 

Changing the Electronics Systems Conversation

Rebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.

IPC Standards: The Heart of the Electronics Industry

From its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

EIPC Winter Conference Review: A Focus on Miniaturization

The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

EMS Leadership Summit: A Smarter Way to Gather EMS Leaders

Mark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.

EIPC Winter Conference 2026 Review: The Keynote Sessions

Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.

Survey Says: Avnet's Insights Into How Engineers Are Adopting AI

Avnet regularly surveys engineers to learn what they’re thinking. That sort of information is quite important to Alex Iuorio, vice president of supplier development at Avnet. In this interview, Alex talks about what he’s learned from the most recent survey and its implications to the supply market in 2026 and beyond. No surprise, AI plays a remarkably large role in all the current trends.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.

Road to Reliability: High Voltage Auxiliaries on the Road

Thus far, this series has focused on power electronics and controls that propel the vehicle. However, EVs are not solely defined by their propulsion system. While much attention is placed on inverters, traction motors, and battery cells, an ecosystem of high-voltage (HV) auxiliary systems sustains safety, comfort, and functionality. These systems, including compressors, heaters, coolant pumps, and the associated cabling, have evolved into critical components that ensure the vehicle functions reliably under a wide range of operating conditions.

The Role of Refurbished Tech Equipment in Corporate ESG Strategies

Environmental, Social, and Governance (ESG) strategies have become central to how modern companies operate, invest, and build trust with stakeholders. Organisations are no longer evaluated only on profitability, as they are increasingly judged on how responsibly they use resources and manage long-term risks. One often overlooked yet highly impactful component of ESG initiatives is the use of refurbished technology equipment.

Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026

Global Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
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