Latest Articles

A Closer Look at SMTA

Tanya Martin, director of operations at SMTA, responded to our I-Connect007 questionnaire recently, which focused on the association’s mission, membership statistics, and how SMTA best serves its members. She also talks about how SMTA satisfies its members' need for technical information, and some of SMTA's success stories in the industry.

Pete’s Top Ten SMT Articles for 2015

Every year, our technical editor and industry veteran Pete Starkey picks his choose of the 10 best SMT technical articles for the year. Check them out.

iNEMI: Leading the Way to Successful Electronics Manufacturing

iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.

IPC: Connecting Electronics Industries

John Mitchell, president and CEO of IPC—Association Connecting Electronics Industries, provides the basic overview of the association—its goals and basic mission, activities, and how it best serves its membership. He also provides a snapshot of how IPC promotes technology development in the industry through standardization.

Kester Highlights Strategies to Address High-Reliability Issues

Lynnette Colby, global product manager at Kester, discusses the biggest challenge their customers are facing—high reliability—and how using materials other than halogen can help address this issue. She also talks about how a complete solder solution—including the paste, flux and wire—help ensure the reliability of the electronics assembly.

Alpha Talks Challenges of Solder Recycling

Jason Fullerton, customer technical support engineer with Alpha, talked with I-Connect007's Patty Goldman about his presentation on recycling solder and why doing this in-house is not a good idea. He also discussed about the new, smaller particle solder pastes and about Alpha’s recycling program that is really beneficial to their customers.

Mentor Graphics: The Past, Present and Future of Analytics

Farid Anani, consulting manager with Mentor Graphics' Valor Division, discusses with I-Connect007's Andy Shaughnessy a paper he presented at SMTAI that focused on analytics and how it can be used to increase business revenue. He also talks about how far analytics has come in the last 20 years and where it may be headed in the future.

Innovative New Uses for Ceramic Column Grid Arrays from TopLine

TopLine President and CEO Martin Hart discusses his paper on ceramic column grid arrays (CCGA) at the recent SMTA International show in Chicago. Hart explains the relationship between CCGA and ball grid arrays (BGA), and TopLine's drive to find new uses for CCGA.

The Key to Understanding Industry 4.0: Show, Don’t Tell!

At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.

Saki Takes 3D Inspection to the Next Level

Eddie Ichiyama, general manager of Saki Europe GmbH and Saki Prague, discusses Saki's new 3D AOI and X-ray inspection equipment, the global inspection marketplace, and the move to reduce or eliminate the human interface. He also talked about their R&D center in the Czech Republic and its activities in the region.

The Associations Issue

Well, it’s the end of the year. How did that happen? It really is true that every year goes by a little faster. You young whippersnappers out there won’t know what I’m talking about, but just you wait and see. We changed it up for our December issues this year. Instead of doing a year-end review, we decided to devote this month to our associations and trade organizations—at least some, because when you start poking around, you will find there are scads of them.

SMART Group: The Guiding Influence in the Electronics Industry

Founded in 1984, the SMART Group promotes advanced manufacturing technologies and helps companies cope with the challenges of surface mount technology. In an interview with I-Connect007, Keith Bryant, chairman of SMART Group, discusses the association, its activities, and how it is supporting the electronics manufacturing and SMT industries.

Honeywell Paper Investigates Avionics Vibration Durability

Dr. Joseph Juarez, principal mechanical engineer at Honeywell International, discusses with I-Connect007's Andy Shaughnessy his SMTA paper, which addresses avionics vibration durability between tin-lead and lead-free solder, the years of testing he conducted, the importance of doing a good soldering job, and some of the surprising findings of his research.

SMTA: Working Hard for the Global Industry

SMTA President Bill Barthel, who is currently serving his second term to this elected position, and who also happens to be the quality solutions manager at Plexus, discusses with I-Connect007's Patty Goldman the role of SMTA, its conference's offerings, the pending departure of longtime SMTA Executive Administrator JoAnn Stromberg, and various opportunities for members of the association.

Alpha's Morgana Ribas on Advances in Lead-Free, High-Reliability Alloys

Morgana Ribas, manager of Alpha's Metals Technology Group in India, presented a paper at the recent SMTA International show in Chicago. She sat down with I-Connect007's Andy Shaughnessy to discuss the paper's focus on high thermal reliability, and some of the new high-reliability lead-free alloys hitting the market.

Digitalization on the Horizon

In the evolution towards the smart manufacturing paradigm, end-user requirements are set to evolve and become more complex than ever before. But the current scenario will also provide the biggest opportunity to realign one's existing business approach and forge alliances and partnerships with market participants. As manufacturers look to the future, they need to examine how advanced information and communication technologies can boost their value creation.

Low-Temperature Thick Film Pastes Permit Lead-Free Soldering

There has been an increased interest in low-temperature polymer thick film products that perform at the same level as their high-temperature counterparts, including high reliability, strong adhesion, and solderability with lead-free solders. This article talks about a new, easy-to-process polymer thick film paste compatible with a variety of substrates, features low temperature curing, and offers excellent solderability with SAC305 solder.

AIM Solder Talks Innovations to Address Assembly, Reliability Issues

David Suraski, executive vice president at AIM Solder's assembly materials division, sat down with us at productronica 2015 to discuss the latest industry trends and customer challenges facing the solder industry, and innovations that are helping customers address their issues. Suraski also talked about reliability issues, and how the company is addressing them.

Saki America Wants to Dominate the Inspection Marketplace

At SMTAI, I-Connect007's Andy Shaughnessy spoke with Quintin Armstrong, general manager for North American sales and service with Saki America. Quintin discussed Saki’s 3D and X-ray inspection equipment and the company’s expansion around the globe, as well as the inspection challenges his customers face every day.

Making Connections with Associations

To provide our readers more information about their associations, this month's issue of SMT Magazine features articles and interviews with SMTA, IPC, iNEMI, SMART Group, and VDMA Productronics, to help understand more their activities, goals, and missions, and how they are helping push forward the electronics manufacturing industry.

Navigating the Global Materials Supply Chain: A Roundtable Discussion

At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).

Sustainable Product Design and Supplier Material Disclosure

One of the biggest challenges for companies in addressing product sustainability initiatives is getting accurate and complete data from their supply chain. This article discusses how manufacturers can automate the process of gathering and managing supplier disclosure data to address current sustainability challenges, gain a competitive edge, and produce innovative and compliant products.

Quality is Key

Johnny Ho, vice president and plant manager at Sanmina Kunshan, discusses winning a Diamond Award from Echostar, and their QA challenges, process improvements, and success. He also talks about having a tight inspection and testing process to improve quality, and the importance of working closely with the customer to achieve a common goal.

Electrolube Discusses Conformal Coating Innovations

At productronica 2015, SMT007 editor, Stephen Las Marias, interviewed Phil Kinner, technical director of Electrolube's Coatings Division, about the latest conformal coating challenges being faced by their customers, and how they are addressing these issues. He also talked about the trends driving product innovation strategies at Electrolube, and some of the new solutions they are offering the market.

Mentor’s Michael Ford on Lean for Surface Mount Processes

Michael Ford, senior marketing development manager with Mentor Graphics, Valor Division, discusses with I-Connect007's Andy Shaughnessy his paper presentation on lean systems in surface mount processes. He also talks about how the industry is now starting to look at Industry 4.0, and why the industry should stop focusing on the endless optimization processes, which are still important, but consider the optimization from the point of view of the product.

Echostar Talks Impact of Quality Process Collaboration with Partners

Ron Meier, senior quality assurance and manufacturing engineering manager at Echostar, discusses with I-Connect007's Edy Yu the importance of working closely with your OEM partner and the impact of having the same process and quality goals.

Printed Circuit Board Failures – Causes and Cures

PCBs can fail for a multitude of reasons. And the ability to detect and identify failures during assembly and final test is preferable to having to accept the consequences of field returns. This article details Bob Willis' recent webinar, which described failure mechanisms, demonstrated the use of standard test methods and tricks of the trade, and explained how to eliminate many of the common causes of PCB defects.

Considering Temperature Control as a Cleaning Method

A proper thermal profile more effectively complexes no-clean flux residues, mitigating a potential product reliability issue. This article discusses variables impacting solder joint quality, and how accurately controlling the thermal profile of the solder reflow can improve the cleanliness of the electronics assemblies.

Tremol SMD Talks EMS Trends and Industry Outlook

At the recent productronica 2015 event in Munich, Germany, I interviewed Kiril Yanneff, CEO of Bulgaria-based EMS firm Tremol SMD about the electronics manufacturing landscape in east Europe and his outlook for the industry. He also spoke about the significance of automating production lines.

Connecting the Enterprise

The growing Industrial IoT trend is going to further fuel the explosion of data as more devices and systems on the factory floor get connected. To bring this manufacturing data into the enterprise where it can be used to generate value, investments in technology and equipment and a mindset shift are necessary.

Managing Big Data from an Analog World

In the age of big data, hardware is evidently no longer the limiting factor in acquisition applications. How do we store and make sense of data? How do we keep them secured? How do we future proof them? These questions become compounded when systems evolve to become more complex, and the amount of data required to describe those systems grow beyond comprehension. More advanced tools will be essential to managing this explosion of data and help engineers make informed decisions faster.

Streamlining PCB Assembly and Test NPI with Shared Component Libraries

PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. This article discusses two engineering processes specifically designed to enable a high degree of production-portability between a product’s design organization and multiple manufacturing facilities and processes.

productronica 2015: Transition Automation Talks about Improving Paste Print Quality for New Markets

Mark Curtin, president of Transition Automation explains the finer points of metal squeegee blades to I-Connect007’s Stephen Las Marias. The improved print quality has proved significant to meet the reliability challenges of high power electronics as well as the increased precision required for newer automotive electronics requirements.

Improving Production Efficiencies with Better Data Strategies

Is your manufacturing company wasting significant time and energy struggling to collect and analyze its own data? I sat down with Bill Moradkhan, the founder, president and CEO of Portus, to discuss the benefits of upgrading your data intelligence to help transform that data into actionable business intelligence and improve your business.

The SMT Internet of Things— Back to Basics

Different people have different understandings and expectations about what the Internet of Things (IoT) actually is, especially with respect to how it could work and what it could bring to the SMT assembly industry. There are a lot of expectations to fulfil as principles behind innovations such as Industry 4.0 take hold.

Made in USA and Total Cost: Six Ways U.S. Sourcing Saves Money

There is no question that manufacturing in countries known for lower labor costs can save money on some projects. In cases of highvolume production, selecting low-cost labor regions close to end markets can generate significant savings and in some cases, fulfill the local content requirements necessary for entry into those markets.

Industry 4.0: Implications for the Asia Pacific Manufacturing Industry

Industry 4.0 refers to a new level of organization and control of the entire value chain, across the life cycle of products. Seen as the fourth industrial revolution, Industry 4.0 seeks to merge physical and virtual worlds. This marks a significant change in the level of complexity from the third industrial revolution, where electronics and information technology were used to automate production.

Super Dry Technology Helps Expand Market Share

Rich Heimsch, director of the Americas for Super Dry-Totech, discusses with I-Connect007's Andy Shaughnessy the specialized moisture management technology that Super Dry has developed, as well as how both the European and American markets are evolving with regard to use of the technology.

A Look at the Theory Behind Tin Whisker Phenomena, Part 3

The third installation in Jennie Hwang's five-part series on tin whisker phenomena continues the discussion on key processes engaged in tin whisker growth. She discusses the energy of free surface, recrystallization, and the impact of solubility and external temperature on grain growth.

Selecting a Through-Hole Soldering System, Part 1

This new article series discusses through-hole assembly, and why it is still a viable and important technique that requires an understanding of the various soldering systems available. Part 1 outlines the available methods and provides a brief overview of their strengths and weaknesses.

The New Industrial Era

Key transformative technologies such as big data, analytics, and IoT are ushering in a new industrial era, where new technology forces and innovations are changing the dynamics, risks, and success factors for global manufacturing companies. To be successful in this environment, a mindset shift is required when it comes to deciding what to do and how to take your manufacturing operations to the next level.

AIM on RoHS Compliance for 2016 and Success with M8

AIM Technical Marketing Manager Tim O'Neill discusses with I-Connect007's Andy Shaughnessy what the next phase of RoHS compliance will mean for AIM’s customers, the success they’re seeing with their new M8 solder paste, and where the company is headed in terms of expansion.

Inspection Innovations to Reduce Cycle Time

Viscom's Guido Bornemann discusses with I-Connect007's Stephen Las Marias the impact of AOI on cycle time, as well as the latest technologies in AOI—such as combining different types of inspection, as well as having integrated communications between different inspection points in a line—that can help customers reduce their inspection time.

Is Automation the Answer to Cycle Time Reduction?

George Liu, sales manager of Finland-based Cencorp Automation, sat for an interview with I-Connect007 to discuss the benefits of automating the backend process to the overall manufacturing line, and why manufacturers need automated solutions now more than ever.

Process Improvements for Cycle Time Reduction

In an interview with I-Connect007's Stephen Las Marias, industry veteran Randall Williams, a mechanical automation engineer at B&P Automation, explains the importance of reducing cycle time, key metrics to look for when planning for improvement processes in assembly lines, best practices to consider, and how automation can help electronics manufacturers improve their production.

Cycle Time Reduction with WORK, Part I

Lean, theory of constraints, quick response manufacturing, cross training, and SPC are powerful, tried and true methodologies for process improvement--but they are rooted in high-volume manufacturing environments and don't always play nice in a high-mix, low-volume operation. This article talks about the new WORK manufacturing strategy specifically developed to overcome these shortcomings while capitalizing on their strengths.

Rehm's Handler Discusses Latest Conformal Coating Machine

Paul Handler, general manager of Rehm Thermal Systems, discusses with I-Connect007's Andy Shaughnessy their latest conformal coating machine, which complements their IR or UV curing ovens. He also talks about the activities being done by the SMTA to provide technical knowledge and information to the industry as a whole.

Reducing Cycle Times with Innovative Bonding Solutions

In an interview with I-Connect007, Gudrun Weigel, head of engineering and a member of the board at Delo, discusses the importance of cycle time reduction, and how the company is helping its customers address this issue through its innovative bonding solutions.

Reducing Print Cycle Time

Of the several steps in the SMT process, an effective method of increasing throughput is to reduce the cycle time of the rate-controlling process step. This article will discuss two simple experiments that may lead to increased throughput and increased profitability.

Technologies to Enable Quick-Turn PCB Assemblies

Multi-day lead times for PCB assembly are a thing of the past as a few advanced thinking assemblers have worked hard to remove the time-related road blocks, enabling quick prototype assembly. This article highlights the latest technologies and innovations in PCB assembly that help electronics manufacturers continue their rapid development of new products and get to the market faster.

Gold Embrittlement Mitigation: Understanding the New J-STD-001 Requirements

With the advent of more information from studies on the behavior of how much gold can impact the mechanical structure of the solder joint, the "washing away" of gold has become more important. This article discusses the significant changes made in the J-STD-001 specification, and their impact in the EMS and OEM industries.

Choosing the Right Component to Reduce Cycle Times

SMAC Moving Coil Actuators president Edward Neff talks with I-Connect007's Stephen Las Marias about the strategies they implement in their production lines to reduce cycle times and go to market faster. He also talks about how using proven components can help manufacturers ensure the uptime of their equipment and processes.

Cycle Time Reduction in the Eye of AOI

In our survey for this month’s topic for SMT Magazine—cycle time reduction—inspection was identified as one of the key issues highlighted by respondents as a bottleneck in their manufacturing process when it comes to cycle times. I spoke with Norihiko Koike, COO of Saki Co. Ltd, to get his insights on this, and how his company is helping their customers address the issue. He also talked about the future technology developments that we can expect in the AOI industry.

Value Stream Mapping: Operationalizing Lean Manufacturing

By applying value stream mapping (VSM), EMS providers can have a clearer picture of multiple processes involved in a work flow, identify waste and its sources, identify where change is required, standardize the process, and identify potential problems that could be encountered in the future state. It can also be used as a tool for planning as well as for managing changes.

Selecting a Reflow Oven, Part 3

In this conclusion of a three-part series on selecting and evaluating a basic reflow oven configuration for a circuit board assembly environment, methods of control and profiling techniques--such as on-board and PC-based control, and on-board, PC-driven and third-party profiling--are discussed and evaluated.

Soldering Process for Molded Interconnect Devices in Three Dimensions

MID (molded interconnect device) technology is used in particular where significant miniaturization, freedom of design with regard to geometry, and a reduced number of components for the electronics assembly is required. This article takes a closer look at vapor distribution to improve the three-dimensional soldering process for a MID application.

Surface Mount Technology Association—a New Milestone

With a grand mission, SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. The organization delivers the right information at the right time to empower the workforce, who collectively advances technology, innovates new products, and serves the global industry.

BTU Talks Challenges and Trends Driving Product Development Strategies

Coco Zhang, product manager at BTU Ltd, discusses with I-Connect007's Stephen Las Marias some of the technology trends and customer challenges and requirements that are driving innovations in their reflow ovens. She talks about energy efficiency, the challenges of complex boards used in the telecom and server industry, and the advanced technology requirements from the semiconductor packaging industry.

Zestron Highlights Benefits of pH-neutral Cleaning Solutions

I-Connect007's Andy Shaughnessy talks with Zestron's Sal Sparacino, marketing and product manager, and Umut Tosun, application technology manager, about the benefits of the company's pH-neutral cleaning agents for defluxing applications, and their advantages over alkaline-based cleaning solutions.

The Need for Speed

I was recently invited to judge the editor’s choice award at National Instrument’s 2015 NI Engineering Impact Awards—ASEAN Regional Contest, and there was one project that I found relevant to our topic for this month’s issue of SMT Magazine. Developed by Gatepacific Circuits Inc., the project improved the process of dispensing paste compared to the manual process done by human operators, and increased the throughput from 500 units to more than 1,000 units.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in