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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Latest Articles
This Month in Design007 Magazine: HDI Design, Landless Vias, VeCS, and More

Roundtable Discussion: App Notes and Fab Notes

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Just Ask Tara Dunn: DFM for Flex and Rigid-Flex

Real Time with… AltiumLive 2020: Event Wrap-Up With Judy Warner

Real Time with… AltiumLive 2020: OSV Project—From Zero to Ventilator PCBs in Record Time

Survey Results: ‘Are You Currently Hiring?’
The Aerospace and Defense Chapter of the HIR

Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features

PCB Technologies Focuses on an All-in-One Solution

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization

Meet Dugan Karnazes, Design007 Columnist

How to Benefit From Robotic Soldering Processes

Real Time with… AltiumLive Europe 2020: Eric Bogatin’s ‘Unlearning’ Keynote

Brad Griffin Discusses Cadence’s New Transient Solver Technology

Real Time with… AltiumLive Europe: If You Don’t Know How It’s Made, How Can You Possibly Design It?

Real Time with… AltiumLive 2020: Cross-Disciplinary Thinking With Eli Hughes

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Real Time with… AltiumLive Europe: 21st-Century Tools Keynote

Real Time with… AltiumLive 2020: Early Communication Key to Success of OSV Project

EIPC Technical Snapshot: Automotive Technology

Real Time with… AltiumLive: Eric Bogatin on Unlearning What You’ve Learned

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Real Time with… AltiumLive 2020: Lawrence Romine on Successful U.S. Event

Real Time with… AltiumLive 2020: Happy Holden’s Panel Discussions Review

Part 6 of Siemens’ Digital Twin Webinar Series: Single CAM Solutions

Real Time with… AltiumLive 2020: Jeremy Blum on Engineering and the Supply Chain

Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote

Real Time with… AltiumLive 2020: Steven Sandler’s Simulation Keynote

Real Time with… AltiumLive 2020: Heidi Barnes Discusses Signal Integrity Panel

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Real Time with… AltiumLive 2020: Greg Ziraldo on a New Approach to DFM

Real Time with… AltiumLive 2020: A Novel Idea—Design With Manufacturing

Real Time with… SMTAI 2020: Reflections on the Technical Conference

Combatting Thermal Challenges With TRM Software

Real Time with… AltiumLive 2020: The Need for Simulation in High-Speed PCB Design

Real Time with… SMTAI 2020: Technical Conference Review

My Experience at SMTAI 2020 Virtual

Just Ask John Mitchell: The Exclusive Compilation

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Flexible Circuit Technology Workshop #5 Tackles Structures, Applications, Materials, and Manufacturing Processes: Think and Plan in Three Dimensions!

Stop Relating Trace Temperature to Current Density

Manufacturing Test Strategy Tools: Part 4 of Siemens’ Digital Twin Webinar Series

Just Ask John Mitchell: Blurring the Lines of Technology

Just Ask John Mitchell: Plans For Knowledge Transfer?

Just Ask John Mitchell: Global Book-to-Bill Number

Real Time with…SMTAI 2020: ASC Makes Lemonade Out of Lemons

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just Ask John Mitchell: Greenfield Capacity in North America?

Just Ask John Mitchell: Emerging Engineers and Managers

Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Mentor and Z-zero Collaborate on New Stackup Tool

Documenting Your Flex Circuit Design

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

I-007eBook Review: Thermal Management From a Fabricator’s Perspective

I-Connect007 Editor's Choice: Five Must-Reads for the Week

American Standard Circuits’ New Book Covers Thermal Management From a Fabricator’s Perspective

NVIDIA’s Three Next-Generation GPUs Excite Consumers
