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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
Wild River Technology's ISI-USB4 Now Supports USB 4.0 Version 2 and DisplayPort 2.1
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Pattern Plating: Latest Episode of On the Line With: Designing for Reality Now Available
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Popular Book on Complex Circuit Board Design Now Available in Audio Format
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June 2024 Design007 Magazine: Creating a Culture of Collaboration
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Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
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MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
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On the Line With… Talks With Cadence Experts on Changing How PCBs Are Designed and the Role of AI
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New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging
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On the Line With… Talks With Cadence Experts on Changing How Circuit Boards Are Designed
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ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event
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Now Available: Episode 2, Season 2 of Designing for Reality— The Design Process
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Dive Into the Depths of Embedded Design in the February 2024 Issue of Design007 Magazine
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I-Connect007 Explores Designing for Reality With ASC Sunstone in Latest Podcast Series
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