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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
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Latest News
Intercept Extends Impedance Calculator App to Apple iOS Devices
03/14/2016 | Intercept Technology Inc.
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
03/08/2016 | Ventec International Group
Cadence’s OrCAD Capture Supports Intel Schematic Connectivity Format
02/17/2016 | Cadence Design Systems, Inc.
EMA Launches Fun Valentine’s Day Contest for Electrical Engineers
02/10/2016 | EMA Design Automation
Corelis to Showcase Latest JTAG & Serial Bus Protocol Products at IPC APEX EXPO 2016
02/02/2016 | Corelis, Inc.
Mentor Graphics Names 26th Annual PCB Technology Leadership Awards Winners
01/21/2016 | Mentor Graphics
ORBOTECH: Gul Technologies Implements InCAM and InPlan Pre-production Solutions
01/19/2016 | Orbotech
Freedom CAD Services Exhibits PCB Offerings at DesignCon
01/13/2016 | Scott McCurdy, Freedom CAD Services
EMA Design Automation Announces Unprecedented OrCAD Offer for Innovators
01/13/2016 | EMA Design Automation
Ventec to Unveil New 'tec-speed' Brand for High Speed/Low Loss Materials at DesignCon 2016
01/13/2016 | Ventec International Group
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