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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
Newbury Electronics Supports NOC to Discover More about the Deep Sea
03/29/2016 | Newbury Electronics
Intercept Extends Impedance Calculator App to Apple iOS Devices
03/14/2016 | Intercept Technology Inc.
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
03/08/2016 | Ventec International Group
Cadence’s OrCAD Capture Supports Intel Schematic Connectivity Format
02/17/2016 | Cadence Design Systems, Inc.
EMA Launches Fun Valentine’s Day Contest for Electrical Engineers
02/10/2016 | EMA Design Automation
Corelis to Showcase Latest JTAG & Serial Bus Protocol Products at IPC APEX EXPO 2016
02/02/2016 | Corelis, Inc.
Mentor Graphics Names 26th Annual PCB Technology Leadership Awards Winners
01/21/2016 | Mentor Graphics
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