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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Latest News
Insulectro Remains Open to Support Fabricators’ Critical Infrastructure Business Demand
03/27/2020 | Insulectro
Keep Up to Date With “Industry Leaders Speak Out: COVID-19 Outbreak” Forum
03/31/2020 | Nolan Johnson, I-Connect007
IPC: Electronics Manufacturing is Essential—Letter to State, Local Leaders
03/23/2020 | Dr. John Mitchell, IPC
Next Gen State-Of-The-Art Embedded Systems Development Platform Announced by Embeddetech
03/19/2020 | Embeddetech
I-Connect007 Publishes Third Annual Show & Tell Magazine All About IPC APEX EXPO 2020
02/19/2020 | I-Connect007 Editorial Team
American Standard Now Offers Book Binder Rigid-Flex Printed Circuit Boards
02/18/2020 | American Standard Circuits
February Issue of Design007 Magazine Available Now
02/13/2020 | Andy Shaughnessy, Design007 Magazine
Cadence Reports Fourth Quarter and Fiscal Year 2019 Financial Results
02/12/2020 | Cadence Design Systems, Inc.
Nominations for the 57th Design Automation Conference Innovators Under 40 Award Now Open
02/11/2020 | Business Wire
Keysight Technologies to Showcase Test Solutions for Automotive Electronic Systems, IoT Systems and Consumer Devices at embedded world 2020
02/10/2020 | Keysight Technologies, Inc.
TowerJazz, Cadence, and Kyiv Polytechnic Institute (KPI) to Open First Analog Design Lab
01/23/2020 | Business Wire
I-007e Micro Webinars Releases Part 2 in ‘Coatings Uncoated!’ Series
01/22/2020 | The I-Connect007 Team
Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2020
01/21/2020 | Rogers Corporation
Ultra Librarian Partners with Maxim Integrated for Interactive Reference Designs
01/21/2020 | EMA Design Automation
Ventec’s High-Speed/Low-Loss/High-Frequency Material Technology Takes Center Stage at U.S. Expos
01/20/2020 | Ventec International Group
Electrolube’s Phil Kinner Launches Series of On-Demand Webinars with I-007e Micro Webinars
01/20/2020 | Electrolube
IPC Statement on U.S.-China Trade Deal
01/15/2020 | Chris Mitchell, IPC VP, Global Government Relations
Cadence Announces Fourth Quarter and Fiscal Year 2019 Financial Results Webcast
01/14/2020 | Cadence Design Systems, Inc.
Rogers to Highlight High-speed Laminates and Next-Gen Thin Materials at DesignCon 2020
01/13/2020 | Rogers Corporation
Sign Up Now for Orange Co. Designers Council Chapter Meeting Jan. 21
01/09/2020 | IPC Designers Council, Orange Co. Chapter
Ventec Invests in Key Equipment to Support Expansion of PTFE Laminates Manufacturing
12/16/2019 | Ventec International Group
December Issue of Design007 Magazine Available Now
12/12/2019 | Andy Shaughnessy, Design007 Magazine
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
12/18/2019 | I-Connect007
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